AMD Xilinx
XC2S300E-7FT256C
XC2S300E-7FT256C ECAD Model
XC2S300E-7FT256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 329 | |
| Number of Outputs | 329 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 93000 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 93000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 300000 | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XC2S300E-7FT256C Datasheet Download
XC2S300E-7FT256C Overview
The XC2S300E-7FT256C chip model is a high-performance digital signal processing device specifically designed for embedded processing, image processing, and other related applications. It is an important part of the modern digital signal processing technology and its development is crucial for the advancement of many industries.
In terms of its original design intention, the XC2S300E-7FT256C chip model is intended to provide a powerful and reliable platform for digital signal processing applications. It is equipped with a 256-bit configuration memory and a 7-stage pipeline architecture, which allows it to process data at a very high speed. Furthermore, it is designed to be easily upgradeable, allowing users to add new features and capabilities as needed.
The XC2S300E-7FT256C chip model is also suitable for advanced communication systems. Its powerful processing capabilities can be used to handle complex network protocols, and its integrated security features ensure that data is always kept safe. Additionally, its small size and low power consumption make it ideal for use in mobile devices.
The XC2S300E-7FT256C chip model can also be used for the development and popularization of future intelligent robots. Its powerful processing capabilities and its ability to handle complex algorithms make it an ideal platform for artificial intelligence applications. In order to use the model effectively, engineers and other technical professionals need to be familiar with HDL (Hardware Description Language) programming.
In conclusion, the XC2S300E-7FT256C chip model is a powerful and reliable platform for digital signal processing, embedded processing, image processing, advanced communication systems, and the development and popularization of future intelligent robots. It is designed to be easily upgradeable, allowing users to add new features and capabilities as needed. In order to use the model effectively, engineers and other technical professionals need to be familiar with HDL programming.
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|---|---|---|
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