AMD Xilinx
XC2S300E-6FT256I
XC2S300E-6FT256I ECAD Model
XC2S300E-6FT256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 329 | |
| Number of Outputs | 329 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 93000 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 93000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 300000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2S300E-6FT256I Datasheet Download
XC2S300E-6FT256I Overview
The XC2S300E-6FT256I chip model is a powerful and versatile device designed for a variety of high-performance digital signal processing, embedded processing, and image processing applications. It is a Field Programmable Gate Array (FPGA), which means that it is programmable with HDL (Hardware Description Language) and can be configured to meet specific requirements. This makes it an ideal choice for a wide range of applications, from basic signal processing to advanced communication systems.
The XC2S300E-6FT256I is designed to provide high-speed data processing, and its features make it suitable for a variety of applications. It has a high-speed logic array and a large number of configurable logic blocks, allowing for a wide range of functions to be implemented. It also has a large number of I/O pins, allowing for a variety of external devices to be connected. The chip also includes a large number of memory elements, allowing for large amounts of data to be stored.
The XC2S300E-6FT256I is also designed to be easily upgradable, allowing for further development and expansion of its capabilities. This makes it an ideal choice for applications in rapidly evolving fields, such as networks and intelligent systems. As the world moves towards a fully intelligent future, the XC2S300E-6FT256I chip model is well-suited to play a part in this transformation. Its high-speed data processing capabilities, combined with its wide range of configurable logic blocks, make it an ideal choice for a variety of intelligent applications.
In conclusion, the XC2S300E-6FT256I chip model is a powerful and versatile device designed for a variety of high-performance digital signal processing, embedded processing, and image processing applications. Its features make it suitable for a wide range of applications, from basic signal processing to advanced communication systems. Furthermore, its upgradability makes it an ideal choice for applications in rapidly evolving fields, such as networks and intelligent systems. As such, the XC2S300E-6FT256I chip model is a great choice for those looking to take advantage of the possibilities of the fully intelligent future.
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1,150 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||