AMD Xilinx
XC2S300E-6FT256C
XC2S300E-6FT256C ECAD Model
XC2S300E-6FT256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 329 | |
| Number of Outputs | 329 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 93000 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 93000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 300000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2S300E-6FT256C Datasheet Download
XC2S300E-6FT256C Overview
The XC2S300E-6FT256C chip model is a powerful and versatile integrated circuit that is increasingly being used in a variety of applications. It is particularly suitable for high-performance digital signal processing, embedded processing, and image processing. The chip model is designed to be programmed using the Hardware Description Language (HDL), making it easy to integrate with other hardware components.
The XC2S300E-6FT256C chip model offers a number of advantages over other chip models. It is capable of handling high-speed signal processing and image processing tasks, making it a great choice for applications that require rapid and reliable signal processing. Additionally, the chip model is designed to be power efficient, allowing for longer battery life in applications that require long-term operation.
The demand for the XC2S300E-6FT256C chip model is expected to continue to increase in the coming years as more applications require high-performance signal processing. In particular, the chip model is likely to be increasingly used in the development and popularization of intelligent robots. The chip model is capable of handling complex tasks, such as navigation and motion control, making it ideal for use in robots.
To use the XC2S300E-6FT256C chip model effectively, certain technical skills are necessary. This includes a good understanding of HDL programming, as well as knowledge of digital signal processing and image processing algorithms. Additionally, knowledge of robotics and artificial intelligence concepts can be helpful in developing applications that use the chip model. With the right skills, the XC2S300E-6FT256C chip model can be a powerful tool for developing and popularizing intelligent robots.
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4,297 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $54.3120 | $54.3120 |
| 10+ | $53.7280 | $537.2800 |
| 100+ | $50.8080 | $5,080.8000 |
| 1000+ | $47.8880 | $23,944.0000 |
| 10000+ | $43.8000 | $43,800.0000 |
| The price is for reference only, please refer to the actual quotation! | ||