AMD Xilinx
XC2S200E-7FT256C
XC2S200E-7FT256C ECAD Model
XC2S200E-7FT256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 289 | |
| Number of Outputs | 289 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 52000 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 52000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 150000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Package Description | FBGA-256 | |
| ECCN Code | EAR99 | |
| Part Package Code | BGA | |
| Pin Count | 256 |
XC2S200E-7FT256C Datasheet Download
XC2S200E-7FT256C Overview
The Xilinx XC2S200E-7FT256C is a high-performance, high-density FPGA chip that is designed to meet the needs of advanced communication systems. It is a high-performance, low-power device capable of handling complex tasks with ease. It is equipped with an impressive array of features that make it suitable for a variety of applications.
The XC2S200E-7FT256C is designed to support the latest generation of communication protocols, such as Ethernet, Wi-Fi, and ZigBee. It is also capable of supporting multiple protocols simultaneously, making it suitable for a range of applications. Additionally, the chip is equipped with an array of I/O pins, allowing it to be used in a variety of applications.
The XC2S200E-7FT256C is also capable of being upgraded for future applications. It is equipped with an array of features that make it suitable for use in advanced communication systems. It is also capable of being used in the era of fully intelligent systems, with its built-in artificial intelligence capabilities.
In terms of product description, the XC2S200E-7FT256C is a high-performance, low-power FPGA chip that is designed to meet the needs of advanced communication systems. It is equipped with an array of features that make it suitable for a variety of applications. It has an impressive array of I/O pins and is capable of supporting multiple protocols simultaneously. It is also capable of being upgraded for future applications and is equipped with built-in artificial intelligence capabilities.
When using the XC2S200E-7FT256C, it is important to consider the specific design requirements of the chip. It is important to ensure that the chip is compatible with the desired communication protocols and that the I/O pins are properly configured. Additionally, it is important to ensure that the chip is properly configured for the desired application and that the chip is properly powered.
The XC2S200E-7FT256C is a versatile chip that is capable of being used in a variety of applications. It is capable of being used in advanced communication systems, as well as in the era of fully intelligent systems. Additionally, it is capable of being upgraded for future applications. In order to ensure the best results, it is important to consider the specific design requirements of the chip and to ensure that the chip is properly configured for the desired application. Additionally, it is important to consider actual case studies and any potential precautions when using the XC2S200E-7FT256C.
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3,154 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $40.6224 | $40.6224 |
| 10+ | $40.1856 | $401.8560 |
| 100+ | $38.0016 | $3,800.1600 |
| 1000+ | $35.8176 | $17,908.8000 |
| 10000+ | $32.7600 | $32,760.0000 |
| The price is for reference only, please refer to the actual quotation! | ||