AMD Xilinx
XC2S200E-6FT256I
XC2S200E-6FT256I ECAD Model
XC2S200E-6FT256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 289 | |
| Number of Outputs | 289 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 52000 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 52000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 150000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2S200E-6FT256I Datasheet Download
XC2S200E-6FT256I Overview
The Xilinx XC2S200E-6FT256I chip model is a cutting-edge technology that is revolutionizing the way we think about the future of computing. This chip model is a field-programmable gate array (FPGA) that is designed to be highly configurable and programmable, allowing for a wide range of applications. It has a wide range of features such as 256Kbits of embedded memory, 8-bit I/O and a maximum clock frequency of 200MHz.
The XC2S200E-6FT256I chip model has many advantages that make it well suited for a variety of applications. It is highly power-efficient, meaning it can be used in a wide range of applications without needing to worry about power consumption. It is also highly configurable, allowing for a wide range of applications and customization. Additionally, the chip model is able to support the latest technologies, such as high-speed networking, artificial intelligence, and machine learning.
The XC2S200E-6FT256I chip model is expected to be in high demand in the future due to its versatility and performance. It is expected to be used in a variety of industries, such as automotive, industrial, and consumer electronics. It is also expected to be used in networks and intelligent systems, as it is able to support the latest technologies. In the future, it is likely that the chip model will be used in the development of fully intelligent systems, such as autonomous vehicles and AI-powered robots.
Overall, the XC2S200E-6FT256I chip model is a powerful and versatile technology that is expected to be in high demand in the future. It is highly configurable and programmable, allowing for a wide range of applications and customization. Additionally, it is able to support the latest technologies, making it well suited for networks and intelligent systems. In the future, it is expected to be used in the development of fully intelligent systems, making it an essential component of the future of computing.
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4,663 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $29.0160 | $29.0160 |
| 10+ | $28.7040 | $287.0400 |
| 100+ | $27.1440 | $2,714.4000 |
| 1000+ | $25.5840 | $12,792.0000 |
| 10000+ | $23.4000 | $23,400.0000 |
| The price is for reference only, please refer to the actual quotation! | ||