XC2S200E-6FT256C
XC2S200E-6FT256C
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rohs

AMD Xilinx

XC2S200E-6FT256C


XC2S200E-6FT256C
F20-XC2S200E-6FT256C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-256
FBGA-256

XC2S200E-6FT256C ECAD Model


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XC2S200E-6FT256C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 289
Number of Outputs 289
Number of Logic Cells 5292
Number of Equivalent Gates 52000
Number of CLBs 864
Combinatorial Delay of a CLB-Max 470 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade COMMERCIAL EXTENDED
Package Shape SQUARE
Technology CMOS
Organization 864 CLBS, 52000 GATES
Additional Feature MAXIMUM USABLE GATES = 150000
Clock Frequency-Max 357 MHz
Power Supplies 1.5/3.3,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-256
Pin Count 256
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01

XC2S200E-6FT256C Datasheet Download


XC2S200E-6FT256C Overview



The XC2S200E-6FT256C chip model is a powerful and versatile tool that can be used to create a wide range of intelligent systems. This chip model is a Field Programmable Gate Array (FPGA) that is designed to be used in high-performance networks. It is capable of handling complex tasks such as data processing, storage, and communication.


The XC2S200E-6FT256C chip model is designed to be used in a wide variety of applications. It can be used to create intelligent systems for various purposes, such as robotics, automation, and machine learning. It is also suitable for use in the development of fully intelligent systems, such as autonomous vehicles and smart homes.


The XC2S200E-6FT256C chip model has a number of features that make it an ideal choice for the development of intelligent systems. It has a large capacity for data storage, which allows for the efficient storage of large amounts of data. It also has a high speed of data transfer, which enables the fast transfer of data between different nodes. Additionally, it is capable of handling complex calculations and tasks, which makes it suitable for the development of intelligent systems.


In order to use the XC2S200E-6FT256C chip model effectively, it is important to understand its product description and specific design requirements. It is also important to understand the actual case studies and precautions that are associated with its use. In addition, it is necessary to have the necessary technical talents in order to use the chip model effectively.


The XC2S200E-6FT256C chip model can be applied to the development and popularization of future intelligent robots. It can be used to create intelligent systems that can be used in various scenarios, such as robotics, automation, and machine learning. It is also suitable for use in the development of fully intelligent systems, such as autonomous vehicles and smart homes. In order to use the chip model effectively, it is important to understand its product description and specific design requirements, as well as the actual case studies and precautions associated with its use. Additionally, it is necessary to have the necessary technical talents in order to use the chip model effectively.



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Unit Price: $26.00
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Pricing (USD)

QTY Unit Price Ext Price
1+ $24.1800 $24.1800
10+ $23.9200 $239.2000
100+ $22.6200 $2,262.0000
1000+ $21.3200 $10,660.0000
10000+ $19.5000 $19,500.0000
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