AMD Xilinx
XC2S150-5FG256Q
XC2S150-5FG256Q ECAD Model
XC2S150-5FG256Q Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 180 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 3888 | |
| Number of Equivalent Gates | 150000 | |
| Number of CLBs | 864 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | AUTOMOTIVE | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 150000 GATES | |
| Clock Frequency-Max | 263 MHz | |
| Power Supplies | 1.5/3.3,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2S150-5FG256Q Datasheet Download
XC2S150-5FG256Q Overview
The chip model XC2S150-5FG256Q is a new model developed by FPGA manufacturer Xilinx, and it has a number of advantages over traditional chips. This model is designed for high-speed, high-performance applications, and it is capable of supporting up to 256 channels of data transmission. It is also designed to be compatible with a variety of communication protocols, including Ethernet, Serial ATA, USB, and others.
The XC2S150-5FG256Q chip model has a number of features that make it suitable for use in a variety of industries. It has a low power consumption, which makes it ideal for use in mobile devices, as well as for use in embedded systems. It is also highly scalable, meaning it can be used for a variety of applications, from consumer electronics to industrial applications.
The chip model also provides a high degree of flexibility, allowing for a variety of configurations. This makes it suitable for use in a variety of networks, from home networks to enterprise networks. It also has a high degree of compatibility with a variety of operating systems, including Windows, Linux, and Mac OS.
The XC2S150-5FG256Q chip model is expected to be in high demand in the future, as it is a powerful and versatile chip model. It is likely to be used in a variety of industries, including automotive, medical, and consumer electronics. It is also likely to be used in a variety of network applications, including wireless networks and the Internet of Things.
In terms of future upgrades, the XC2S150-5FG256Q chip model is designed to be highly upgradable. It is possible to add additional features or increase the speed of the chip, depending on the specific application. This makes it well-suited for use in advanced communication systems, such as 5G networks.
The XC2S150-5FG256Q chip model is also likely to be used in a variety of intelligent scenarios. It is capable of providing a high level of performance and scalability, making it suitable for use in a variety of intelligent applications, such as machine learning and artificial intelligence. It is also likely to be used in the era of fully intelligent systems, as it is capable of providing the necessary performance and scalability to support these systems.
In conclusion, the XC2S150-5FG256Q chip model is a powerful and versatile chip model that is expected to be in high demand in the future. It is capable of supporting a variety of communication protocols and is highly upgradable, making it suitable for use in advanced communication systems. It is also likely to be used in a variety of intelligent scenarios, making it suitable for use in the era of fully intelligent systems.
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5,609 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $12.8340 | $12.8340 |
| 10+ | $12.6960 | $126.9600 |
| 100+ | $12.0060 | $1,200.6000 |
| 1000+ | $11.3160 | $5,658.0000 |
| 10000+ | $10.3500 | $10,350.0000 |
| The price is for reference only, please refer to the actual quotation! | ||