XC2S100E-6FT256Q
XC2S100E-6FT256Q
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rohs

AMD Xilinx

XC2S100E-6FT256Q


XC2S100E-6FT256Q
F20-XC2S100E-6FT256Q
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-256
FBGA-256

XC2S100E-6FT256Q ECAD Model


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XC2S100E-6FT256Q Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 182
Number of Outputs 178
Number of Logic Cells 2700
Number of Equivalent Gates 37000
Number of CLBs 600
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade AUTOMOTIVE
Package Shape SQUARE
Technology CMOS
Organization 600 CLBS, 37000 GATES
Additional Feature MAXIMUM NO OF GATE 100000
Clock Frequency-Max 357 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 1.55 mm
Ihs Manufacturer XILINX INC
Package Description FBGA-256
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
ECCN Code EAR99

XC2S100E-6FT256Q Datasheet Download


XC2S100E-6FT256Q Overview



The XC2S100E-6FT256Q chip model is an advanced integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other related applications. It is designed to be used with the Hardware Description Language (HDL) and offers a wide range of features and capabilities.


The XC2S100E-6FT256Q chip model is equipped with a powerful processor that can handle complex tasks. It also has a large memory capacity, which allows for efficient data storage and retrieval. Additionally, the chip model has a high-speed interface that enables fast data transfer. Moreover, the chip model is designed to be energy efficient, making it suitable for use in a wide range of applications.


The XC2S100E-6FT256Q chip model is expected to be in high demand in the coming years due to its advanced features and capabilities. It is expected to be used in a variety of industries, including automotive, medical, aerospace, and industrial automation. Additionally, the chip model is likely to be used in the development and popularization of future intelligent robots.


To use the XC2S100E-6FT256Q chip model effectively, technical professionals need to have a good understanding of HDL and the chip model’s features and capabilities. Additionally, they need to have a good understanding of the application scenarios the chip model is designed for, such as digital signal processing, embedded processing, and image processing. Furthermore, they need to be familiar with the various programming languages that can be used to create applications for the chip model.


In conclusion, the XC2S100E-6FT256Q chip model is a powerful integrated circuit that is suitable for a variety of applications, including digital signal processing, embedded processing, image processing, and more. It is expected to be in high demand in the future and is likely to be used in the development and popularization of future intelligent robots. To use the chip model effectively, technical professionals need to have a good understanding of HDL and the chip model’s features and capabilities, as well as the various programming languages that can be used to create applications for the chip model.



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Unit Price: $24.384
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Pricing (USD)

QTY Unit Price Ext Price
1+ $22.6771 $22.6771
10+ $22.4333 $224.3328
100+ $21.2141 $2,121.4080
1000+ $19.9949 $9,997.4400
10000+ $18.2880 $18,288.0000
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