XC2S100E-6FT256I
XC2S100E-6FT256I
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rohs

AMD Xilinx

XC2S100E-6FT256I


XC2S100E-6FT256I
F20-XC2S100E-6FT256I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-256
FBGA-256

XC2S100E-6FT256I ECAD Model


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XC2S100E-6FT256I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 202
Number of Outputs 202
Number of Logic Cells 2700
Number of Equivalent Gates 37000
Number of CLBs 600
Combinatorial Delay of a CLB-Max 470 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 600 CLBS, 37000 GATES
Additional Feature MAXIMUM USABLE GATES = 100000
Clock Frequency-Max 357 MHz
Power Supplies 1.5/3.3,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-256
Pin Count 256
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01

XC2S100E-6FT256I Datasheet Download


XC2S100E-6FT256I Overview



The Xilinx XC2S100E-6FT256I chip model is a groundbreaking technology that has revolutionized the industry. This chip model is a Field Programmable Gate Array (FPGA) device, which is a type of integrated circuit that can be programmed to perform specific logic and communication functions. It is designed to be used in applications that require high-performance and low-power usage, such as robotics and embedded systems.


The XC2S100E-6FT256I chip model is capable of providing up to 100,000 logic cells and 256 Mb of block RAM. It also has a wide range of features, such as high-speed transceivers, high-speed I/Os, and embedded memory blocks. This chip model is ideal for applications that require high-performance and low-power usage.


In terms of industry trends, the XC2S100E-6FT256I chip model is becoming increasingly popular in the robotics and embedded systems industries. It is being used in a variety of applications, such as autonomous vehicles, drones, and industrial automation. This chip model is also being used in the development of intelligent robots, as it is capable of providing the necessary performance and power efficiency.


In order to effectively use the XC2S100E-6FT256I chip model, certain technical talents are required. This includes knowledge of FPGA programming, as well as experience in embedded systems and robotics. Additionally, knowledge of the specific design requirements of the chip model is necessary, as well as knowledge of the actual case studies and precautions associated with the chip model.


The XC2S100E-6FT256I chip model is a powerful technology that is transforming the robotics and embedded systems industries. It is capable of providing the necessary performance and power efficiency, and is becoming increasingly popular in various industries. In order to effectively use the chip model, certain technical talents are required, such as knowledge of FPGA programming and experience in robotics and embedded systems. With the ever-evolving industry trends and the potential of this chip model, it is sure to be a major player in the development and popularization of future intelligent robots.



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Unit Price: $379.2785
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Pricing (USD)

QTY Unit Price Ext Price
1+ $352.7290 $352.7290
10+ $348.9362 $3,489.3622
100+ $329.9723 $32,997.2295
1000+ $311.0084 $155,504.1850
10000+ $284.4589 $284,458.8750
The price is for reference only, please refer to the actual quotation!

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