AMD Xilinx
XC2S100-5FG256Q
XC2S100-5FG256Q ECAD Model
XC2S100-5FG256Q Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 180 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 2700 | |
| Number of Equivalent Gates | 100000 | |
| Number of CLBs | 600 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | AUTOMOTIVE | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 100000 GATES | |
| Clock Frequency-Max | 263 MHz | |
| Power Supplies | 1.5/3.3,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2S100-5FG256Q Datasheet Download
XC2S100-5FG256Q Overview
The XC2S100-5FG256Q is a highly advanced chip model that is suitable for a range of applications, including high-performance digital signal processing, embedded processing, and image processing. This chip model was designed with the intention of providing users with a reliable, flexible, and powerful solution for their needs. It is programmed using the HDL language, which is an easy to learn language that is widely used in the industry.
The XC2S100-5FG256Q chip model offers a number of advantages that make it an attractive option for users. It is highly reliable, with a low failure rate and a long lifespan. It is also highly efficient, with a low power consumption and a high clock speed. Additionally, it is highly flexible, allowing users to customize the chip to suit their specific needs. Furthermore, the chip has a wide range of features, including a variety of input and output ports, as well as a built-in memory controller.
The XC2S100-5FG256Q chip model is expected to be in high demand in the coming years. This is due to the increasing demand for high-performance digital signal processing, embedded processing, and image processing. As the demand for these applications grows, so too will the demand for the XC2S100-5FG256Q chip model. Additionally, the chip model is likely to be used in a variety of industries, including automotive, aerospace, and medical.
The original design intention of the XC2S100-5FG256Q chip model was to provide users with a reliable, flexible, and powerful solution for their needs. It was designed to be highly efficient and reliable, with a low power consumption and a long lifespan. Additionally, the chip model was designed to be highly flexible, allowing users to customize the chip to suit their specific needs.
The XC2S100-5FG256Q chip model is capable of being upgraded in the future. This is due to its modular design, which allows users to easily add new features or upgrade existing ones. Additionally, the chip model is capable of being used in advanced communication systems, such as 5G networks. This is due to its high clock speed and its wide range of input and output ports.
In conclusion, the XC2S100-5FG256Q chip model is a highly advanced chip model that is suitable for a range of applications, including high-performance digital signal processing, embedded processing, and image processing. It is programmed using the HDL language, which is an easy to learn language that is widely used in the industry. The chip model offers a number of advantages, including a low failure rate and a high clock speed. Additionally, it is expected to be in high demand in the coming years due to the increasing demand for these types of applications. Furthermore, the chip model is capable of being upgraded in the future and can be used in advanced communication systems.
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5,317 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $21.9629 | $21.9629 |
| 10+ | $21.7267 | $217.2672 |
| 100+ | $20.5459 | $2,054.5920 |
| 1000+ | $19.3651 | $9,682.5600 |
| 10000+ | $17.7120 | $17,712.0000 |
| The price is for reference only, please refer to the actual quotation! | ||