
Intel Corporation
EP3SL70F780C4N
EP3SL70F780C4N ECAD Model
EP3SL70F780C4N Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 488 | |
Number of Outputs | 488 | |
Number of Logic Cells | 67500 | |
Number of CLBs | 2700 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 2700 CLBS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Power Supplies | 1.2/3.3 V | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B780 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 780 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA780,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 29 mm | |
Length | 29 mm | |
Seated Height-Max | 3.2 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | LEAD FREE, FBGA-780 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SL70F780C4N Datasheet Download
EP3SL70F780C4N Overview
The chip model EP3SL70F780C4N is a powerful and versatile tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed using the HDL language, which gives it a wide range of potential applications. With the advancement of technology, the EP3SL70F780C4N chip can be used in a variety of scenarios, including networks and intelligent systems.
The EP3SL70F780C4N chip is designed to meet the needs of modern digital signal processing, embedded processing, and image processing. It is a highly integrated device that combines a variety of components into a single package. This allows the chip to be used in a variety of applications, including high-performance digital signal processing, embedded processing, image processing, and more.
The EP3SL70F780C4N chip is also capable of being used in networks and intelligent systems. With its powerful capabilities, it can be used to create networks of connected devices that can be used to automate processes and collect data. It can also be used to create intelligent systems that can make decisions based on the data they collect. This makes the chip a powerful tool for creating intelligent systems that can be used in a variety of scenarios.
The EP3SL70F780C4N chip is also capable of being used in the era of fully intelligent systems. With its powerful capabilities, the chip can be used to create intelligent systems that can make decisions based on the data they collect. This makes the chip a powerful tool for creating intelligent systems that can be used in a variety of scenarios.
The EP3SL70F780C4N chip is a versatile and powerful tool for high-performance digital signal processing, embedded processing, image processing, and more. It is designed to be programmed using the HDL language, which gives it a wide range of potential applications. With the advancement of technology, the EP3SL70F780C4N chip can be used in a variety of scenarios, including networks and intelligent systems. It is also capable of being used in the era of fully intelligent systems, making it a powerful tool for creating intelligent systems that can be used in a variety of scenarios. In the future, the EP3SL70F780C4N chip will continue to be used in a variety of applications and scenarios, making it an important tool for the advancement of technology.
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1,774 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $591.4827 | $591.4827 |
10+ | $585.1227 | $5,851.2267 |
100+ | $553.3225 | $55,332.2523 |
1000+ | $521.5224 | $260,761.1890 |
10000+ | $477.0022 | $477,002.1750 |
The price is for reference only, please refer to the actual quotation! |