Intel Corporation
EP3SL50F780C2N
EP3SL50F780C2N ECAD Model
EP3SL50F780C2N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 47500 | |
| Number of CLBs | 1900 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 1900 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.2 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL50F780C2N Datasheet Download
EP3SL50F780C2N Overview
The chip model EP3SL50F780C2N is a high-performance and low-power digital signal processor (DSP) designed by Altera Corporation. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language.
The original design intention of the EP3SL50F780C2N is to provide a low-cost solution for high-performance DSP applications. It features a high-performance 32-bit processor core, a large internal memory, and a variety of I/O peripherals. It is also capable of supporting a wide range of external memory interfaces and communication protocols.
The EP3SL50F780C2N is also capable of being upgraded in the future. It can be used for advanced communication systems due to its flexible design and the availability of additional components. Additionally, its high-performance processor and memory can be utilized to develop and popularize future intelligent robots.
In order to use the EP3SL50F780C2N effectively, technical talents with experience in hardware and software design are needed. Knowledge in digital signal processing and HDL language is essential in order to program the chip and utilize its maximum capabilities. Additionally, knowledge in communication protocols and memory interfaces is also necessary in order to make full use of the chip's features.
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3,520 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $634.2625 | $634.2625 |
| 10+ | $627.4425 | $6,274.4248 |
| 100+ | $593.3423 | $59,334.2349 |
| 1000+ | $559.2422 | $279,621.1070 |
| 10000+ | $511.5020 | $511,502.0250 |
| The price is for reference only, please refer to the actual quotation! | ||