Intel Corporation
EP3SL50F780C4LN
EP3SL50F780C4LN ECAD Model
EP3SL50F780C4LN Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 47500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL50F780C4LN Datasheet Download
EP3SL50F780C4LN Overview
The chip model EP3SL50F780C4LN is a highly advanced and powerful chip designed to support a wide range of applications. It is an advanced field programmable gate array (FPGA) that combines the flexibility of programmability with the high performance of a dedicated circuit. This chip is designed to provide superior performance, scalability, and low power consumption for a variety of applications.
The EP3SL50F780C4LN chip is designed to support a range of communication systems, including voice, data, and multimedia networks. It has a wide range of features and capabilities, including high-speed serial transceivers, high-speed memory interfaces, and digital signal processing (DSP) blocks. This chip can be used in a range of applications, from embedded systems to large-scale communication systems.
The EP3SL50F780C4LN chip is designed to be highly flexible and upgradeable. It is designed with a scalable architecture that allows it to be upgraded with new features and capabilities as needed. This chip can also be used in advanced communication systems, such as 5G and beyond. It is designed to be able to support the latest technologies and protocols, including advanced modulation and coding techniques.
The EP3SL50F780C4LN chip has a wide range of applications in the communications industry. It can be used in a variety of applications, from embedded systems to large-scale communication systems. It is also designed to be highly reliable and secure, making it suitable for use in mission-critical applications.
The product description of the EP3SL50F780C4LN chip includes detailed specifications and performance data. This chip is designed to provide superior performance, scalability, and low power consumption for a variety of applications. It is also designed to be highly upgradeable and to support the latest technologies and protocols.
When using the EP3SL50F780C4LN chip, it is important to consider the specific application requirements and the environment in which it will be used. It is important to ensure that the chip is compatible with the specific application requirements and that it can be upgraded as needed. It is also important to ensure that the chip is secure and reliable, and that it can be used in mission-critical applications.
In conclusion, the EP3SL50F780C4LN chip is a highly advanced and powerful chip designed to support a wide range of applications. It has a wide range of features and capabilities, making it suitable for a variety of applications. It is designed to be highly flexible and upgradeable, and to support the latest technologies and protocols. It is important to consider the specific application requirements and the environment in which it will be used when using this chip.
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4,318 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $562.6529 | $562.6529 |
| 10+ | $556.6029 | $5,566.0285 |
| 100+ | $526.3527 | $52,635.2697 |
| 1000+ | $496.1025 | $248,051.2710 |
| 10000+ | $453.7523 | $453,752.3250 |
| The price is for reference only, please refer to the actual quotation! | ||