
Intel Corporation
EP3SL70F780C4LN
EP3SL70F780C4LN ECAD Model
EP3SL70F780C4LN Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 488 | |
Number of Outputs | 488 | |
Number of Logic Cells | 67500 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Clock Frequency-Max | 717 MHz | |
Power Supplies | 1.2/3.3 V | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B780 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 780 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA780,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 29 mm | |
Length | 29 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | LEAD FREE, FBGA-780 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SL70F780C4LN Datasheet Download
EP3SL70F780C4LN Overview
The chip model EP3SL70F780C4LN is a high-performance Field Programmable Gate Array (FPGA) developed by Altera Corporation. It is suitable for a variety of applications, such as high-performance digital signal processing, embedded processing, image processing, and more. The chip model EP3SL70F780C4LN requires the use of HDL language for programming.
In terms of industry trends, the chip model EP3SL70F780C4LN and the related industries are constantly evolving. To meet the demands of changing application environments, new technologies are often required. For instance, the chip model EP3SL70F780C4LN may require the use of advanced programming languages or new algorithms to achieve better performance.
The product description of the chip model EP3SL70F780C4LN includes its features, such as its high-performance architecture, its low power consumption, and its ability to support a wide range of applications. It also includes the specific design requirements for the chip model EP3SL70F780C4LN, such as the programming language, the number of logic elements, the number of I/O pins, and more.
In addition, actual case studies and precautions should be taken into consideration when using the chip model EP3SL70F780C4LN. For example, the user should be aware of the potential risks associated with the chip model EP3SL70F780C4LN, such as the possibility of data loss or hardware damage. The user should also be aware of the specific design requirements for the chip model EP3SL70F780C4LN, such as the programming language, the number of logic elements, the number of I/O pins, and more.
Overall, the chip model EP3SL70F780C4LN is a powerful and versatile FPGA that can be used for a variety of applications. It is important to understand the industry trends, product description, and design requirements of the chip model EP3SL70F780C4LN, as well as the potential risks associated with its use, in order to ensure a successful implementation.
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3,835 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $886.2905 | $886.2905 |
10+ | $876.7605 | $8,767.6046 |
100+ | $829.1104 | $82,911.0435 |
1000+ | $781.4604 | $390,730.2050 |
10000+ | $714.7504 | $714,750.3750 |
The price is for reference only, please refer to the actual quotation! |