Intel Corporation
EP3SL110F780C4LN
EP3SL110F780C4LN ECAD Model
EP3SL110F780C4LN Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 107500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL110F780C4LN Datasheet Download
EP3SL110F780C4LN Overview
The chip model EP3SL110F780C4LN is a powerful and reliable solution for high-performance digital signal processing, embedded processing and image processing. It is designed to meet the requirements of advanced application scenarios and is capable of providing high-performance computing. The chip model is based on HDL language and provides a cost-effective solution for the development of advanced applications.
The EP3SL110F780C4LN chip model has many advantages that make it an ideal choice for a wide range of applications. It has a high processing speed, low power consumption, and high reliability. The chip model also features a high-performance computing architecture, which makes it suitable for applications such as image processing, embedded processing, and digital signal processing. It also provides a flexible and extensible programming environment which allows developers to customize the chip model for their specific needs.
The EP3SL110F780C4LN chip model is expected to be in high demand in the future, as the demand for high-performance computing solutions continues to grow. The chip model is also expected to be used in advanced communication systems, as it is capable of providing reliable and efficient communication solutions. The chip model is also expected to be upgraded in the future, as new technologies and advancements are made.
The EP3SL110F780C4LN chip model was originally designed with the intention of providing a powerful and reliable solution for high-performance digital signal processing, embedded processing, and image processing. Its design allows for the development of advanced applications, and it can be easily adapted to meet the needs of different applications. The chip model is also capable of being upgraded and is expected to be used in advanced communication systems in the future. With its high performance and reliability, the EP3SL110F780C4LN chip model is an ideal choice for a wide range of applications.
You May Also Be Interested In
4,867 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,679.5840 | $1,679.5840 |
| 10+ | $1,661.5240 | $16,615.2396 |
| 100+ | $1,571.2237 | $157,122.3741 |
| 1000+ | $1,480.9235 | $740,461.7630 |
| 10000+ | $1,354.5032 | $1,354,503.2250 |
| The price is for reference only, please refer to the actual quotation! | ||