Intel Corporation
EP3SE80F780C4LN
EP3SE80F780C4LN ECAD Model
EP3SE80F780C4LN Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 80000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE80F780C4LN Datasheet Download
EP3SE80F780C4LN Overview
The chip model EP3SE80F780C4LN is a high-performance FPGA device designed by Altera Corporation, a leading provider of programmable logic solutions. This chip model is designed with the intention of providing a cost-effective solution for advanced communication systems, making it an ideal choice for applications requiring high performance and low power consumption.
The EP3SE80F780C4LN chip model is based on the Stratix III architecture, which provides a high degree of flexibility and scalability for future upgrades. This chip model is capable of supporting up to 80 million logic elements, making it a powerful device for advanced communication systems. Additionally, the device is equipped with multiple I/O interfaces, allowing for the connection of a wide range of external peripherals.
The EP3SE80F780C4LN chip model is also suitable for use in networks and intelligent scenarios. The device is designed to support advanced networking protocols, such as Ethernet and Wi-Fi, as well as a wide range of intelligent applications. With its high performance and low power consumption, the device is capable of supporting the development and popularization of future intelligent robots.
In order to make full use of the EP3SE80F780C4LN chip model, it is necessary to have a strong understanding of the underlying architecture and its capabilities. As such, technical expertise in the fields of FPGA programming, embedded systems, and networking is essential for effectively utilizing the device. Additionally, having knowledge of the latest trends in artificial intelligence and robotics will be beneficial in order to maximize the potential of the device in the era of fully intelligent systems.
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3,437 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,857.2150 | $1,857.2150 |
| 10+ | $1,837.2450 | $18,372.4497 |
| 100+ | $1,737.3947 | $173,739.4698 |
| 1000+ | $1,637.5444 | $818,772.2140 |
| 10000+ | $1,497.7541 | $1,497,754.0500 |
| The price is for reference only, please refer to the actual quotation! | ||