Intel Corporation
EP3SE50F780C4LN
EP3SE50F780C4LN ECAD Model
EP3SE50F780C4LN Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 47500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE50F780C4LN Datasheet Download
EP3SE50F780C4LN Overview
The EP3SE50F780C4LN chip model is a powerful and versatile device that is suitable for a range of applications in the field of digital signal processing, embedded processing, and image processing. It is designed to be programmed using HDL, a hardware description language that enables users to create complex and powerful systems. This chip model offers a number of advantages, including its ability to handle large amounts of data quickly and accurately, its low power consumption, and its cost-effectiveness.
The EP3SE50F780C4LN chip model is expected to be increasingly used in the future, particularly in the fields of digital signal processing, embedded processing, and image processing. This is due to the increasing demand for high-performance systems in these industries, as well as the chip model's ability to meet these needs.
The EP3SE50F780C4LN chip model is also expected to be used in networks, as well as in intelligent scenarios. This is due to its ability to handle large amounts of data quickly and accurately, as well as its low power consumption. In addition, it is expected to be used in the era of fully intelligent systems, as it can be used to create powerful and efficient systems that can handle complex tasks.
In conclusion, the EP3SE50F780C4LN chip model is a powerful and versatile device that is suitable for a range of applications in the field of digital signal processing, embedded processing, and image processing. It is expected to be increasingly used in the future, particularly in the fields of digital signal processing, embedded processing, and image processing, as well as in networks and intelligent scenarios. It is also expected to be used in the era of fully intelligent systems, as it can be used to create powerful and efficient systems that can handle complex tasks.
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2,475 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $886.2905 | $886.2905 |
| 10+ | $876.7605 | $8,767.6046 |
| 100+ | $829.1104 | $82,911.0435 |
| 1000+ | $781.4604 | $390,730.2050 |
| 10000+ | $714.7504 | $714,750.3750 |
| The price is for reference only, please refer to the actual quotation! | ||