Intel Corporation
EP3SE50F780C2N
EP3SE50F780C2N ECAD Model
EP3SE50F780C2N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 47500 | |
| Number of CLBs | 1900 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 1900 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.2 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE50F780C2N Datasheet Download
EP3SE50F780C2N Overview
The chip model EP3SE50F780C2N is a powerful and advanced integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It is equipped with a high-speed processor, a large number of memory components, and a wide range of peripherals, making it suitable for a variety of applications. It also requires the use of HDL language for programming.
The EP3SE50F780C2N chip model is a trendsetter in the industry, and its applications are constantly evolving. As the technology advances, new technologies are required to support the ever-changing application environment. Currently, the chip model is being used in a variety of fields, including robotics, artificial intelligence, and autonomous vehicles.
The EP3SE50F780C2N chip model is well-suited for the development and popularization of future intelligent robots. Its powerful processor, extensive memory, and wide range of peripherals make it an ideal choice for these types of applications. To use the chip model effectively, technical talents such as software engineers, hardware engineers, and data scientists are needed.
In conclusion, the EP3SE50F780C2N chip model is a powerful and advanced integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It is capable of supporting the development and popularization of future intelligent robots, and requires the use of HDL language for programming. Technical talents such as software engineers, hardware engineers, and data scientists are needed to use the model effectively.
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3,591 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $998.8217 | $998.8217 |
| 10+ | $988.0817 | $9,880.8166 |
| 100+ | $934.3816 | $93,438.1566 |
| 1000+ | $880.6815 | $440,340.7380 |
| 10000+ | $805.5014 | $805,501.3500 |
| The price is for reference only, please refer to the actual quotation! | ||