Intel Corporation
EP3SE110F780C2N
EP3SE110F780C2N ECAD Model
EP3SE110F780C2N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 107500 | |
| Number of CLBs | 4300 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 4300 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.2 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, FBGA-780 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE110F780C2N Datasheet Download
EP3SE110F780C2N Overview
The chip model EP3SE110F780C2N is a high-performance, low-power field-programmable gate array (FPGA) designed for digital signal processing, embedded processing, and image processing applications. It is built on the latest 28nm process technology and is optimized for high performance and low power consumption. It also features a rich set of interfaces and I/O options, making it suitable for a wide range of applications.
The EP3SE110F780C2N supports the latest HDL (Hardware Description Language) technology, allowing users to program their FPGA with a high-level language. This makes it easier to design complex digital systems and allows for a high degree of flexibility. Additionally, the chip is highly scalable and can be used in a variety of applications, from high-end embedded systems to low-power consumer electronics.
The EP3SE110F780C2N is an ideal choice for designers who need a high-performance, low-power, and cost-effective FPGA solution. The chip can be used for a variety of applications, from digital signal processing and embedded processing to image processing. Additionally, its support for HDL technology makes it easier to develop complex digital systems.
In terms of future industry trends, the EP3SE110F780C2N is expected to remain a popular choice among designers due to its high performance and low power consumption. As the demand for low-power and cost-effective solutions increases, the chip is likely to become even more popular. Furthermore, as new technologies emerge, the EP3SE110F780C2N may need to be updated to support them.
Overall, the EP3SE110F780C2N is an excellent choice for designers who need a high-performance, low-power, and cost-effective FPGA solution. Its support for HDL technology allows for a high degree of flexibility, while its scalability makes it suitable for a wide range of applications. Additionally, its popularity and demand are expected to remain strong in the future, making it an ideal choice for designers.
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5,472 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,434.5096 | $3,434.5096 |
| 10+ | $3,397.5794 | $33,975.7941 |
| 100+ | $3,212.9284 | $321,292.8357 |
| 1000+ | $3,028.2773 | $1,514,138.6510 |
| 10000+ | $2,769.7658 | $2,769,765.8250 |
| The price is for reference only, please refer to the actual quotation! | ||