AMD Xilinx
XQ5VSX50T-2EF665I
XQ5VSX50T-2EF665I ECAD Model
XQ5VSX50T-2EF665I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 52224 | |
| Number of CLBs | 4080 | |
| Combinatorial Delay of a CLB-Max | 770 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.265 GHz | |
| Power Supplies | 1,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B665 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 665 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA665,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.9 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FCBGA-665 | |
| Pin Count | 665 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XQ5VSX50T-2EF665I Datasheet Download
XQ5VSX50T-2EF665I Overview
The chip model XQ5VSX50T-2EF665I is a cutting-edge technology developed by the semiconductor industry. This chip model is designed to meet the needs of the modern communication systems. It has a wide range of applications, including 5G communication, artificial intelligence, and the Internet of Things. It has many advantages, such as a high-speed data transfer rate, low power consumption, and low cost.
The industry trends of the chip model XQ5VSX50T-2EF665I are expected to be very positive in the future. As the demand for 5G communication, artificial intelligence, and the Internet of Things increases, the demand for the XQ5VSX50T-2EF665I is expected to grow. This chip model is expected to become the standard for many modern communication systems.
The original design intention of the chip model XQ5VSX50T-2EF665I was to provide a powerful and efficient solution for modern communication systems. It was designed with advanced features such as a high-speed data transfer rate, low power consumption, and low cost. It has the potential to be upgraded to support more advanced communication systems in the future.
The application environment for the chip model XQ5VSX50T-2EF665I may require the support of new technologies. Depending on the specific technologies needed, the chip model may need to be upgraded to support these new technologies. The chip model is designed to be highly flexible, so it is possible to upgrade the chip model to meet the needs of the application environment.
In conclusion, the chip model XQ5VSX50T-2EF665I is a cutting-edge technology developed by the semiconductor industry. It has many advantages, such as a high-speed data transfer rate, low power consumption, and low cost. The industry trends of the chip model are expected to be very positive in the future, and it has the potential to be upgraded to support more advanced communication systems. The application environment for the chip model may require the support of new technologies, and the chip model is designed to be highly flexible so it can be upgraded to meet the needs of the application environment.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||