AMD Xilinx
XQ5VFX70T-1EF665I
XQ5VFX70T-1EF665I ECAD Model
XQ5VFX70T-1EF665I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 71680 | |
| Number of CLBs | 6080 | |
| Combinatorial Delay of a CLB-Max | 900 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B665 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 665 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA665,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.9 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FCBGA-665 | |
| Pin Count | 665 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XQ5VFX70T-1EF665I Datasheet Download
XQ5VFX70T-1EF665I Overview
The XQ5VFX70T-1EF665I chip model is a powerful, versatile, and reliable solution for a wide range of applications, including networking and intelligent systems. This chip model is designed to meet the needs of a variety of industries, and offers a number of advantages over other models.
The XQ5VFX70T-1EF665I chip model is a high-performance system-on-chip (SoC) with a scalable, multi-core architecture. It is designed to provide high levels of performance and power efficiency, and is suitable for a variety of applications, including networking, multimedia, and artificial intelligence (AI) applications. The chip model features a wide range of features, including advanced memory controllers, multiple I/O interfaces, and a low-power design.
In terms of networking applications, the XQ5VFX70T-1EF665I chip model provides advanced networking features, such as advanced packet processing, flow control, and security. With its advanced networking features, the chip model is suitable for a variety of applications, such as wireless networks, data centers, and cloud computing. It is also suitable for applications in the field of AI, such as natural language processing, image recognition, and machine learning.
In terms of intelligent scenarios, the XQ5VFX70T-1EF665I chip model is designed to be used in the era of fully intelligent systems. It is capable of supporting a wide range of AI technologies, such as deep learning, natural language processing, and computer vision. The chip model is also suitable for applications in the field of robotics, such as autonomous navigation and object recognition.
In terms of product design and specific requirements, the XQ5VFX70T-1EF665I chip model is designed to meet the needs of a variety of industries. It is capable of supporting a wide range of applications, including networking, multimedia, and AI. The chip model is also designed for low-power operation, and is capable of supporting a wide range of I/O interfaces.
In terms of case studies and precautions, the XQ5VFX70T-1EF665I chip model has been used in a variety of applications, including networking, multimedia, and AI. It has been used in a variety of applications, including autonomous navigation, image recognition, and natural language processing. In terms of precautions, it is important to ensure that the chip model is used in an appropriate environment, and that the appropriate safety measures are taken.
In conclusion, the XQ5VFX70T-1EF665I chip model is a powerful, versatile, and reliable solution for a wide range of applications, including networking, multimedia, and AI. It is designed to meet the needs of a variety of industries, and offers a number of advantages over other models. It is capable of supporting a wide range of applications, including networking, multimedia, and AI, and is suitable for applications in the field of robotics. In terms of product design and specific requirements, the chip model is designed for low-power operation, and is capable of supporting a wide range of I/O interfaces. In terms of case studies and precautions, it is important to ensure that the chip model is used in an appropriate environment, and that the appropriate safety measures are taken. With its advanced features and versatile design, the XQ5VFX70T-1EF665I chip model is expected to remain in high demand in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||