
AMD Xilinx
XQ5VSX50T-1EF665I
XQ5VSX50T-1EF665I ECAD Model
XQ5VSX50T-1EF665I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 360 | |
Number of Outputs | 360 | |
Number of Logic Cells | 52224 | |
Number of CLBs | 4080 | |
Combinatorial Delay of a CLB-Max | 900 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.098 GHz | |
Power Supplies | 1,2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B665 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 665 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA665,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.9 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FCBGA-665 | |
Pin Count | 665 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XQ5VSX50T-1EF665I Datasheet Download
XQ5VSX50T-1EF665I Overview
The chip model XQ5VSX50T-1EF665I is a powerful semiconductor device that has become increasingly popular in the industry due to its advanced features and capabilities. It is a high-performance, low-power, multi-core processor that is designed for modern embedded systems. It has a wide range of applications in various fields, such as telecommunications, automotive, industrial control, and networking.
The XQ5VSX50T-1EF665I chip model is designed to meet the needs of high-performance embedded systems. It is based on an advanced 32-bit microprocessor architecture and provides an integrated dual-core processor, a multi-core DSP, and a variety of peripherals. It is suitable for applications requiring high performance and low power consumption. The chip model also supports a variety of communication protocols, such as Ethernet, USB, and CAN.
The XQ5VSX50T-1EF665I chip model has been widely used in various industries and applications. For example, in the automotive industry, it has been used in the development of advanced driver assistance systems (ADAS) and autonomous driving systems. In the industrial control field, it has been used in the development of advanced industrial automation systems. In the networking field, it has been used in the development of advanced networking systems.
In terms of future development, the XQ5VSX50T-1EF665I chip model is expected to be upgraded in the future to support new technologies, such as 5G and AI, as well as more advanced communication protocols. The chip model is also expected to be further optimized in terms of power consumption and performance.
The product description of the XQ5VSX50T-1EF665I chip model includes its features, specifications, and performance parameters. It also provides detailed information on the design requirements, including the operating voltage range, the power consumption, the memory size, and the clock frequency. Furthermore, it provides information on the available peripherals, such as the Ethernet and USB ports, as well as the communication protocols supported.
In terms of actual case studies, the XQ5VSX50T-1EF665I chip model has been successfully used in various projects, such as the development of autonomous driving systems and advanced industrial automation systems. It has also been used in the development of advanced networking systems. Furthermore, the chip model has been used in the development of advanced communication systems, such as 5G and AI.
In terms of precautions, it is important to note that the XQ5VSX50T-1EF665I chip model is designed for specific applications and may not be suitable for all environments. It is important to consider the design requirements and application environment before using the chip model. Furthermore, it is important to ensure that the chip model is properly configured and tested before use.
In conclusion, the XQ5VSX50T-1EF665I chip model is a powerful semiconductor device that has a wide range of applications in various industries. It is designed to meet the needs of high-performance embedded systems and supports a variety of communication protocols. In terms of future development, the chip model is expected to be upgraded in the future to support new technologies, such as 5G and AI. Furthermore, the product description and design requirements of the chip model, as well as actual case studies and precautions, should be carefully considered before use.
You May Also Be Interested In
3,081 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
No reference price found. |