AMD Xilinx
XQ2VP70-5FF1704N
XQ2VP70-5FF1704N ECAD Model
XQ2VP70-5FF1704N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 996 | |
| Number of Outputs | 996 | |
| Number of Logic Cells | 74448 | |
| Number of CLBs | 8272 | |
| Combinatorial Delay of a CLB-Max | 360 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8272 CLBS | |
| Clock Frequency-Max | 1.05 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1704 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1704 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1704,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.45 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1704,42X42,40 | |
| Pin Count | 1704 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQ2VP70-5FF1704N Datasheet Download
XQ2VP70-5FF1704N Overview
The chip model XQ2VP70-5FF1704N is a high-performance, low-power, and cost-effective solution for a variety of applications. It is designed to deliver reliable performance and scalability to meet the demands of today’s complex network environments. This chip model is based on the latest Intel® Architecture and incorporates a range of features to provide a high level of performance, power efficiency, and cost savings.
In terms of industry trends, the chip model XQ2VP70-5FF1704N is an ideal choice for a variety of applications. It is capable of supporting a wide range of network protocols, including Ethernet, Wi-Fi, Bluetooth, and more. It is also well-suited for high-speed applications such as video streaming, gaming, and virtual reality. Furthermore, it is capable of supporting multiple operating systems, including Windows, Linux, and Mac OS.
In terms of the future development of related industries, the chip model XQ2VP70-5FF1704N is expected to be used in a variety of scenarios, including the Internet of Things (IoT), artificial intelligence (AI), and autonomous driving. It is also expected to be used in the era of fully intelligent systems, as it is capable of providing the necessary support for the latest technologies, such as 5G networks and edge computing.
In terms of product description and design requirements, the chip model XQ2VP70-5FF1704N is a high-performance, low-power, and cost-effective solution for a variety of applications. It is designed to deliver reliable performance and scalability to meet the demands of today’s complex network environments. It is based on the latest Intel® Architecture and incorporates a range of features to provide a high level of performance, power efficiency, and cost savings.
In terms of actual case studies, the chip model XQ2VP70-5FF1704N has been used in a variety of applications, including medical devices, home automation systems, and industrial control systems. It has also been used in a variety of networked systems, such as data centers and wireless networks. Furthermore, it has been used in a variety of embedded systems, such as automotive and consumer electronics.
Finally, in terms of precautions, it is important to note that the chip model XQ2VP70-5FF1704N is capable of supporting a wide range of network protocols, including Ethernet, Wi-Fi, Bluetooth, and more. Therefore, it is important to ensure that the system is designed to take full advantage of the chip model’s capabilities. Additionally, it is important to ensure that the system is designed to be compatible with the latest technologies, such as 5G networks and edge computing.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||