XC2VPX70-6FF1704I
XC2VPX70-6FF1704I
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rohs

AMD Xilinx

XC2VPX70-6FF1704I


XC2VPX70-6FF1704I
F20-XC2VPX70-6FF1704I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA1704,42X42,40
BGA, BGA1704,42X42,40

XC2VPX70-6FF1704I ECAD Model


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XC2VPX70-6FF1704I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Not Recommended
Supply Voltage-Nom 1.5 V
Number of Inputs 992
Number of Outputs 992
Number of Logic Cells 74448
Number of CLBs 8272
Combinatorial Delay of a CLB-Max 320 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 8272 CLBS
Clock Frequency-Max 1.2 GHz
Power Supplies 1.5,1.5/3.3,2/2.5,2.5 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B1704
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1704
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1704,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.45 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA, BGA1704,42X42,40
Pin Count 1704
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC2VPX70-6FF1704I Datasheet Download


XC2VPX70-6FF1704I Overview



The chip model XC2VPX70-6FF1704I is a powerful and advanced integrated circuit (IC) designed for use in a wide range of applications. It is a highly configurable and versatile IC that can be used in a variety of applications, including networking, embedded systems, and industrial control. The XC2VPX70-6FF1704I is built on a Xilinx Virtex-7 FPGA architecture and is capable of providing high-speed data processing, flexible configuration options, and low power consumption.


As the semiconductor industry continues to evolve, the XC2VPX70-6FF1704I is well-positioned to take advantage of the latest technologies. It is capable of supporting new technologies such as artificial intelligence (AI) and machine learning (ML), allowing it to be used in more intelligent scenarios. It is also capable of supporting the latest network protocols such as 5G and Wi-Fi 6, allowing it to be used in more advanced networking applications.


In addition to its advanced features, the XC2VPX70-6FF1704I also offers a wide range of design options. It is capable of being configured to meet a variety of design requirements, allowing it to be used in a wide range of applications. It is also capable of being used in different environments, including industrial, automotive, and consumer applications.


The XC2VPX70-6FF1704I is a powerful and reliable chip model that can be used in a variety of applications. It is capable of providing high-speed data processing, flexible configuration options, and low power consumption. It is also capable of supporting new technologies such as AI and ML, as well as the latest network protocols. With its wide range of design options, it is well-suited for use in a variety of applications, including networking, embedded systems, and industrial control. Additionally, it is also capable of being used in different environments, including industrial, automotive, and consumer applications.


When considering the use of the XC2VPX70-6FF1704I, it is important to consider the specific design requirements of the application. Additionally, it is important to consider the actual environment in which the chip model will be used and the associated risks. In order to ensure the successful implementation of the XC2VPX70-6FF1704I, it is important to consider the various case studies and best practices that have been developed to ensure its successful use.



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