
AMD Xilinx
XC2VPX70-6FF1704I
XC2VPX70-6FF1704I ECAD Model
XC2VPX70-6FF1704I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Not Recommended | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 992 | |
Number of Outputs | 992 | |
Number of Logic Cells | 74448 | |
Number of CLBs | 8272 | |
Combinatorial Delay of a CLB-Max | 320 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 8272 CLBS | |
Clock Frequency-Max | 1.2 GHz | |
Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1704 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1704 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1704,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.45 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA1704,42X42,40 | |
Pin Count | 1704 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC2VPX70-6FF1704I Datasheet Download
XC2VPX70-6FF1704I Overview
The chip model XC2VPX70-6FF1704I is a powerful and advanced integrated circuit (IC) designed for use in a wide range of applications. It is a highly configurable and versatile IC that can be used in a variety of applications, including networking, embedded systems, and industrial control. The XC2VPX70-6FF1704I is built on a Xilinx Virtex-7 FPGA architecture and is capable of providing high-speed data processing, flexible configuration options, and low power consumption.
As the semiconductor industry continues to evolve, the XC2VPX70-6FF1704I is well-positioned to take advantage of the latest technologies. It is capable of supporting new technologies such as artificial intelligence (AI) and machine learning (ML), allowing it to be used in more intelligent scenarios. It is also capable of supporting the latest network protocols such as 5G and Wi-Fi 6, allowing it to be used in more advanced networking applications.
In addition to its advanced features, the XC2VPX70-6FF1704I also offers a wide range of design options. It is capable of being configured to meet a variety of design requirements, allowing it to be used in a wide range of applications. It is also capable of being used in different environments, including industrial, automotive, and consumer applications.
The XC2VPX70-6FF1704I is a powerful and reliable chip model that can be used in a variety of applications. It is capable of providing high-speed data processing, flexible configuration options, and low power consumption. It is also capable of supporting new technologies such as AI and ML, as well as the latest network protocols. With its wide range of design options, it is well-suited for use in a variety of applications, including networking, embedded systems, and industrial control. Additionally, it is also capable of being used in different environments, including industrial, automotive, and consumer applications.
When considering the use of the XC2VPX70-6FF1704I, it is important to consider the specific design requirements of the application. Additionally, it is important to consider the actual environment in which the chip model will be used and the associated risks. In order to ensure the successful implementation of the XC2VPX70-6FF1704I, it is important to consider the various case studies and best practices that have been developed to ensure its successful use.
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