AMD Xilinx
XC2VPX70-5FFG1704I
XC2VPX70-5FFG1704I ECAD Model
XC2VPX70-5FFG1704I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Not Recommended | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 992 | |
| Number of Outputs | 992 | |
| Number of Logic Cells | 74448 | |
| Number of CLBs | 8272 | |
| Combinatorial Delay of a CLB-Max | 360 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8272 CLBS | |
| Clock Frequency-Max | 1.05 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1704 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1704 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1704,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.45 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1704,42X42,40 | |
| Pin Count | 1704 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VPX70-5FFG1704I Datasheet Download
XC2VPX70-5FFG1704I Overview
The XC2VPX70-5FFG1704I chip model is a high-performance digital signal processor (DSP) for embedded processing, image processing, and other applications. It is designed to be used with the HDL language, which allows for greater flexibility and scalability. This chip model can be used in a variety of applications, including high-performance digital signal processing, embedded processing, image processing, and more.
The original design intention of the XC2VPX70-5FFG1704I chip model was to provide a powerful and efficient solution for digital signal processing. The chip was designed to be upgradeable, allowing for future upgrades that may be necessary as technology advances. This chip model can also be used in advanced communication systems, allowing for the efficient transmission of data.
The XC2VPX70-5FFG1704I chip model can be used in networks, allowing for the transmission of data across multiple devices. It can also be used in intelligent scenarios, allowing for the development of intelligent systems. This chip model can also be used in the era of fully intelligent systems, allowing for the development of more advanced systems.
Overall, the XC2VPX70-5FFG1704I chip model is a powerful and efficient solution for digital signal processing, embedded processing, image processing, and more. It is designed to be upgradeable, allowing for future upgrades as technology advances. It can also be used in networks and intelligent scenarios, allowing for the development of more advanced systems. This chip model is a great solution for those looking for a powerful and efficient processor.
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