XCZU48DR-L2FSVE1156I
XCZU48DR-L2FSVE1156I
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rohs

AMD Xilinx

XCZU48DR-L2FSVE1156I


XCZU48DR-L2FSVE1156I
F20-XCZU48DR-L2FSVE1156I
Active
CMOS, FLIPCHIP-1156
FLIPCHIP-1156

XCZU48DR-L2FSVE1156I ECAD Model


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XCZU48DR-L2FSVE1156I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 720 mV
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Technology CMOS
Supply Voltage-Max 742 mV
Supply Voltage-Min 698 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Package Description FLIPCHIP-1156
Date Of Intro 2019-02-20

XCZU48DR-L2FSVE1156I Datasheet Download


XCZU48DR-L2FSVE1156I Overview



The XCZU48DR-L2FSVE1156I chip model is a powerful and versatile integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is based on the Xilinx UltraScale+ architecture and is ideal for applications requiring the use of HDL language. The chip model is designed to meet the needs of advanced communication systems and can be easily upgraded to meet future requirements.


The XCZU48DR-L2FSVE1156I chip model is built with a wide range of features, such as a dual-core ARM Cortex-A53 processor, high-speed memory, and a high-performance FPGA. It also includes a wide range of peripherals, including PCIe, USB, and Ethernet. The chip model is designed to be highly scalable and can be used in a wide variety of applications.


In terms of product description, the XCZU48DR-L2FSVE1156I chip model is designed to be easily integrated into existing systems. It is designed for use in high-performance applications and requires the use of HDL language. The chip model is also designed to be highly reliable and has built-in safety features to protect against power surges and other environmental factors.


When it comes to specific design requirements, the XCZU48DR-L2FSVE1156I chip model requires the use of Xilinx Vivado Design Suite for development and debugging. Additionally, the chip model requires the use of the Xilinx UltraScale+ architecture, which is specifically designed to meet the needs of advanced communication systems.


In terms of case studies, the XCZU48DR-L2FSVE1156I chip model has been used in a variety of applications, such as embedded systems, medical imaging, and industrial automation. In each of these applications, the chip model has demonstrated its ability to meet the needs of the specific application. Additionally, the chip model has been used in a variety of research projects, such as image processing and machine learning.


Finally, when using the XCZU48DR-L2FSVE1156I chip model, it is important to take the necessary precautions. It is important to ensure that the chip model is properly installed and configured, and that the correct HDL language is used. Additionally, it is important to ensure that the chip model is properly powered and cooled. By following these precautions, users can ensure that the chip model performs as expected.



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