AMD Xilinx
XCZU48DR-L1FSVE1156I
XCZU48DR-L1FSVE1156I ECAD Model
XCZU48DR-L1FSVE1156I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Technology | CMOS | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FLIPCHIP-1156 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2019-02-20 |
XCZU48DR-L1FSVE1156I Datasheet Download
XCZU48DR-L1FSVE1156I Overview
The chip model XCZU48DR-L1FSVE1156I is an advanced technology solution that has been developed with the intention of providing an efficient, cost-effective solution for a wide range of applications. It is designed to provide the highest performance at the lowest cost, making it an attractive option for many industries.
The XCZU48DR-L1FSVE1156I is a high-performance, low-cost chip model that offers a wide range of features, including support for high-speed data transfer, low-power operation, and advanced security features. It is capable of supporting a wide range of applications, including communications, automotive, industrial, and consumer applications. This chip model is designed to provide the highest performance at the lowest cost, making it an attractive option for many industries.
The XCZU48DR-L1FSVE1156I is designed to support the latest industry standards, such as the 5G and 6G networks. It is also capable of supporting advanced communication systems, such as the Internet of Things (IoT) and Machine-to-Machine (M2M) communication systems. This chip model is designed to provide the highest performance at the lowest cost, making it an attractive option for many industries.
The XCZU48DR-L1FSVE1156I is designed to be upgradeable, allowing for future upgrades to meet the changing needs of the industry. This chip model is designed to be able to support the latest technologies, such as the 5G and 6G networks, as well as advanced communication systems. It is also capable of supporting the latest industry standards, such as the Internet of Things (IoT) and Machine-to-Machine (M2M) communication systems.
The XCZU48DR-L1FSVE1156I is designed to meet the needs of current and future applications. It is expected to be in high demand in the near future, due to its low cost and high performance. It is likely to be used in a wide range of industries, including communications, automotive, industrial, and consumer applications. This chip model is designed to provide the highest performance at the lowest cost, making it an attractive option for many industries.
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1,598 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||