AMD Xilinx
XCZU48DR-L1FFVE1156I
XCZU48DR-L1FFVE1156I ECAD Model
XCZU48DR-L1FFVE1156I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Technology | CMOS | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FLIPCHIP-1156 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2019-02-20 |
XCZU48DR-L1FFVE1156I Datasheet Download
XCZU48DR-L1FFVE1156I Overview
The chip model XCZU48DR-L1FFVE1156I is a powerful and reliable chip model designed to meet the needs of the modern high-performance digital signal processing, embedded processing, and image processing industries. It is designed to be used with the HDL language and offers a wide range of features and capabilities.
The XCZU48DR-L1FFVE1156I chip model has a number of advantages that make it a desirable choice for many different applications. It is highly efficient, allowing for faster processing speeds and improved performance. It is also highly reliable, ensuring that the chip model will continue to perform as expected for a long time. Additionally, it is highly versatile, allowing it to be used in a variety of different applications.
The demand for the XCZU48DR-L1FFVE1156I chip model is expected to continue to increase in the future. As the need for high-performance digital signal processing, embedded processing, and image processing continues to grow, the chip model is likely to remain a popular choice. Additionally, as new technologies become available, the chip model may become even more desirable as it will be able to take advantage of these new technologies.
The original design intention of the XCZU48DR-L1FFVE1156I chip model was to provide a reliable and powerful chip model that could be used in a variety of different applications. The chip model was designed to be highly efficient, reliable, and versatile, ensuring that it would remain a popular choice for many years to come. Additionally, the chip model was designed with the possibility of future upgrades in mind, allowing it to take advantage of new technologies as they become available.
The XCZU48DR-L1FFVE1156I chip model is also capable of being used in advanced communication systems. As the need for high-speed and reliable communication systems continues to grow, the chip model is likely to become even more desirable. It is designed to be able to handle the increased demand and is capable of providing a reliable and powerful solution for communication systems.
In conclusion, the XCZU48DR-L1FFVE1156I chip model is a powerful and reliable chip model that is designed to meet the needs of the modern digital signal processing, embedded processing, and image processing industries. It is highly efficient, reliable, and versatile, making it a desirable choice for many different applications. Additionally, it is designed with the possibility of future upgrades in mind, allowing it to take advantage of new technologies as they become available. It is also capable of being used in advanced communication systems, making it an even more attractive choice for many industries.
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5,243 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
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| No reference price found. | ||