XCZU48DR-2FFVE1156I
XCZU48DR-2FFVE1156I
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rohs

AMD Xilinx

XCZU48DR-2FFVE1156I


XCZU48DR-2FFVE1156I
F20-XCZU48DR-2FFVE1156I
Active
CMOS, FLIPCHIP-1156
FLIPCHIP-1156

XCZU48DR-2FFVE1156I ECAD Model


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XCZU48DR-2FFVE1156I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FLIPCHIP-1156
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Date Of Intro 2019-02-20

XCZU48DR-2FFVE1156I Datasheet Download


XCZU48DR-2FFVE1156I Overview



The chip model XCZU48DR-2FFVE1156I is a cutting-edge product developed by Xilinx, a leading provider of programmable logic devices. This model is designed to provide a high level of performance and flexibility to meet the needs of a wide range of applications. It features a high-speed, low-power, and highly reliable architecture, and is capable of supporting a variety of communication protocols.


The XCZU48DR-2FFVE1156I chip model offers a number of advantages over its competitors. It is designed to provide a high level of performance and flexibility, allowing for faster communication and data processing. It also offers a more efficient power consumption and a lower cost of ownership compared to other models. Additionally, the chip model is designed to be highly reliable, allowing for a longer lifespan and less maintenance.


Given the advantages of the XCZU48DR-2FFVE1156I chip model, it is expected that demand for the model will continue to grow in the coming years. It is likely to be used increasingly in a variety of industries, including telecommunications, automotive, aerospace, and medical. Its high-speed and low-power architecture makes it well-suited for use in advanced communication systems, and its reliability and cost-effectiveness make it an attractive option for a wide range of applications.


The original design intention of the XCZU48DR-2FFVE1156I chip model was to provide a high level of performance and flexibility for a variety of applications. The chip model is designed to be highly upgradable, allowing for future upgrades and enhancements. This makes it well-suited for use in the development and popularization of future intelligent robots, as well as in other advanced communication systems.


In order to use the XCZU48DR-2FFVE1156I chip model effectively, it is necessary to have technical skills in a variety of areas. These include knowledge of programming languages such as C/C++, Python, and Verilog, as well as experience in designing and developing embedded systems. Additionally, knowledge of communication protocols and wireless technologies is also important. With the right technical skills, the XCZU48DR-2FFVE1156I chip model can be used effectively to develop and popularize future intelligent robots and advanced communication systems.



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