XCZU48DR-2FFVE1156E
XCZU48DR-2FFVE1156E
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rohs

AMD Xilinx

XCZU48DR-2FFVE1156E


XCZU48DR-2FFVE1156E
F20-XCZU48DR-2FFVE1156E
Active
CMOS, FLIPCHIP-1156
FLIPCHIP-1156

XCZU48DR-2FFVE1156E ECAD Model


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XCZU48DR-2FFVE1156E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FLIPCHIP-1156
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Date Of Intro 2019-02-20

XCZU48DR-2FFVE1156E Datasheet Download


XCZU48DR-2FFVE1156E Overview



The XCZU48DR-2FFVE1156E is a powerful chip model designed for high-performance digital signal processing, embedded processing, and image processing. It is capable of handling complex tasks and requires the use of HDL language to program it. The chip model is designed with the intention of providing reliable and efficient performance for various applications.


The XCZU48DR-2FFVE1156E is a versatile chip model that can be used in a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications requiring advanced communication systems. The chip model has the capability to upgrade and expand its capabilities to meet the needs of the user.


The product description of the XCZU48DR-2FFVE1156E includes a range of features such as a high-speed processor, advanced memory, and a wide range of I/O ports. The chip model also features a low-power design and is capable of operating at low voltages. It is also designed for compatibility with a wide range of operating systems and software.


The specific design requirements of the XCZU48DR-2FFVE1156E must be taken into consideration when using the chip model. It is important to ensure that the design meets the requirements of the application and that the chip model is programmed correctly. It is also important to consider the possible future upgrades and expansions of the chip model.


Case studies of the XCZU48DR-2FFVE1156E have been conducted to demonstrate its effectiveness in various applications. These studies have shown that the chip model is capable of providing reliable and efficient performance for various applications. In addition, the studies have also highlighted some of the potential issues that may arise when using the chip model.


Finally, it is important to note that the XCZU48DR-2FFVE1156E should be used with caution. Before using the chip model, it is important to read the product description and the specific design requirements to ensure that the chip model is programmed correctly. In addition, it is important to consider the possible future upgrades and expansions of the chip model to ensure that the chip model is capable of meeting the requirements of the application.



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