
AMD Xilinx
XCZU48DR-1FSVE1156E
XCZU48DR-1FSVE1156E ECAD Model
XCZU48DR-1FSVE1156E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B1156 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 240 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | FLIPCHIP-1156 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Date Of Intro | 2019-02-20 |
XCZU48DR-1FSVE1156E Datasheet Download
XCZU48DR-1FSVE1156E Overview
The XCZU48DR-1FSVE1156E chip model is a powerful and versatile solution for a wide range of applications. It is designed to meet the needs of the most demanding users, offering a high level of performance, reliability, and scalability. With its advanced features, this chip model is suitable for a variety of applications, from consumer electronics to industrial automation and embedded systems.
The XCZU48DR-1FSVE1156E chip model offers a range of advantages. It is capable of handling high-speed data, providing a reliable and efficient communication platform. It also offers low power consumption, making it suitable for applications where power efficiency is a priority. Additionally, it is highly scalable, making it suitable for a wide range of applications.
The XCZU48DR-1FSVE1156E chip model is expected to be in high demand in the near future. Its advanced features make it suitable for a variety of applications, from consumer electronics to industrial automation and embedded systems. As the demand for these types of applications grows, the demand for the XCZU48DR-1FSVE1156E chip model is expected to increase as well.
The XCZU48DR-1FSVE1156E chip model was designed with the intention of providing a powerful and reliable solution for a variety of applications. It is capable of handling high-speed data, providing a reliable and efficient communication platform. Additionally, its low power consumption makes it suitable for applications where power efficiency is a priority. It is also highly scalable, making it suitable for a wide range of applications.
The XCZU48DR-1FSVE1156E chip model is capable of future upgrades, allowing users to take advantage of new features as they become available. It is also suitable for advanced communication systems, making it an ideal choice for applications that require high levels of performance and reliability.
When designing with the XCZU48DR-1FSVE1156E chip model, there are certain design requirements that must be taken into account. These include the input voltage, current, and power requirements, as well as the output voltage, current, and power requirements. Additionally, the chip model must be designed with the appropriate memory and peripheral interfaces to ensure that it is compatible with the desired application.
To ensure the best performance from the XCZU48DR-1FSVE1156E chip model, it is important to follow the design specifications and to take into account the actual case studies and precautions. For example, it is important to consider the environment in which the chip model will be used, as well as any potential risks associated with the application. Additionally, it is important to ensure that the chip model is compatible with the desired application and that it is properly tested and validated before being deployed in production.
In conclusion, the XCZU48DR-1FSVE1156E chip model is a powerful and versatile solution for a wide range of applications. It is designed to meet the needs of the most demanding users, offering a high level of performance, reliability, and scalability. With its advanced features, this chip model is suitable for a variety of applications, from consumer electronics to industrial automation and embedded systems, and is expected to be in high demand in the near future. Additionally, it is capable of future upgrades, allowing users to take advantage of new features as they become available, and is suitable for advanced communication systems. When designing with the XCZU48DR-1FSVE1156E chip model, it is important to follow the design specifications and to take into account the actual case studies and precautions to ensure the best performance.
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