AMD Xilinx
XCZU47DR-L2FSVE1156I
XCZU47DR-L2FSVE1156I ECAD Model
XCZU47DR-L2FSVE1156I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Technology | CMOS | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FLIPCHIP-1156 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2019-02-20 |
XCZU47DR-L2FSVE1156I Datasheet Download
XCZU47DR-L2FSVE1156I Overview
The chip model XCZU47DR-L2FSVE1156I is a powerful and versatile integrated circuit (IC) designed for high-performance digital signal processing, embedded processing, image processing, and more. It is suitable for embedded applications such as industrial automation, medical imaging, automotive, and aerospace. This model is equipped with a number of features such as a dual-core ARM Cortex-A53 processor, an on-chip memory controller, and a high-speed memory interface, making it suitable for a wide range of applications.
In order to use the chip model XCZU47DR-L2FSVE1156I, designers must be familiar with hardware description languages (HDLs) such as Verilog and VHDL. These languages are used to describe the design of the chip in terms of its logic, data flow, and timing. Designers must also understand the chip's architecture and specifications in order to create an efficient and reliable design.
When designing with the chip model XCZU47DR-L2FSVE1156I, designers need to consider the power consumption, area, and performance of the design. They must also consider the electrical and mechanical characteristics of the chip and its environment, as well as the reliability and manufacturability of the design. In addition, designers must also consider the cost of the design and the impact of the design on the user experience.
The chip model XCZU47DR-L2FSVE1156I is suitable for future intelligent robots, as it has the necessary capabilities to process the data and signals that are required for such applications. To use the chip model effectively, designers need to have a good understanding of HDLs and the chip's architecture and specifications. They must also be familiar with the electrical and mechanical characteristics of the chip and its environment, as well as the reliability and manufacturability of the design. In addition, they must be able to optimize the design for power consumption, area, and performance. Finally, they must have the knowledge and experience to create a cost-effective design that meets the user's needs.
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5,073 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $21,161.9863 | $21,161.9863 |
| 10+ | $20,934.4381 | $209,344.3808 |
| 100+ | $19,796.6969 | $1,979,669.6880 |
| 1000+ | $18,658.9557 | $9,329,477.8400 |
| 10000+ | $17,066.1180 | $17,066,118.0000 |
| The price is for reference only, please refer to the actual quotation! | ||