AMD Xilinx
XCZU47DR-L1FSVE1156I
XCZU47DR-L1FSVE1156I ECAD Model
XCZU47DR-L1FSVE1156I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Technology | CMOS | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FLIPCHIP-1156 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2019-02-20 |
XCZU47DR-L1FSVE1156I Datasheet Download
XCZU47DR-L1FSVE1156I Overview
The XCZU47DR-L1FSVE1156I is an advanced chip model designed to accommodate a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. This chip model is designed to allow users to take advantage of the latest industry trends and technologies, while still providing the performance and reliability needed for their applications.
The XCZU47DR-L1FSVE1156I is designed to be highly efficient and reliable. It utilizes the latest technologies, such as high-speed digital signal processing, to ensure that the chip model is capable of meeting the most demanding requirements. This chip model is also designed to be highly scalable, allowing for future upgrades and improvements.
The XCZU47DR-L1FSVE1156I is designed to be highly compatible with a wide range of applications. It is capable of being used in advanced communication systems, such as 5G networks, due to its high-speed digital signal processing capabilities. This chip model is also capable of being used in a variety of other applications, such as embedded systems, machine learning, and artificial intelligence.
The XCZU47DR-L1FSVE1156I is designed to be highly reliable and cost-effective. It is designed to be highly efficient, allowing users to take advantage of the latest technologies while still providing the performance and reliability needed for their applications. The chip model is also designed to be highly scalable, allowing for future upgrades and improvements.
The XCZU47DR-L1FSVE1156I is expected to be in high demand in the future, as it is designed to be highly efficient and reliable. It is capable of being used in a variety of applications, such as high-performance digital signal processing, embedded systems, machine learning, and artificial intelligence. This chip model is also designed to be highly scalable, allowing for future upgrades and improvements.
Overall, the XCZU47DR-L1FSVE1156I is a highly efficient and reliable chip model that is designed to meet the most demanding requirements. It is capable of being used in advanced communication systems, such as 5G networks, due to its high-speed digital signal processing capabilities. This chip model is also designed to be highly scalable, allowing for future upgrades and improvements. As such, it is expected to be in high demand in the future, as it is designed to meet the most demanding requirements.
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6,000 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||