AMD Xilinx
XCZU47DR-L1FFVE1156I
XCZU47DR-L1FFVE1156I ECAD Model
XCZU47DR-L1FFVE1156I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Technology | CMOS | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FLIPCHIP-1156 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2019-02-20 |
XCZU47DR-L1FFVE1156I Datasheet Download
XCZU47DR-L1FFVE1156I Overview
The XCZU47DR-L1FFVE1156I chip model is a powerful and versatile device designed to meet the needs of a wide range of applications. It is a high-performance, low-power, and cost-effective solution that provides a comprehensive set of features and functions. The XCZU47DR-L1FFVE1156I chip model was designed with the intention of providing a comprehensive solution for the communication needs of modern systems. It is capable of providing high-speed, low-latency, and reliable communication over a wide range of networks and protocols.
The XCZU47DR-L1FFVE1156I chip model is capable of supporting advanced communication systems, such as 5G, Wi-Fi, Bluetooth, and more. It is also capable of supporting advanced intelligent scenarios, such as machine learning, artificial intelligence, and natural language processing. It is also capable of providing a high level of security, with support for secure boot, secure storage, and secure communication protocols.
The XCZU47DR-L1FFVE1156I chip model is highly configurable, allowing users to customize the device to their specific needs. It has a wide range of features, including a high-speed processor, large memory, and extensive I/O capabilities. It also supports multiple operating systems, including Linux, Windows, and Android. The device is also designed to be highly scalable, allowing it to be used in a variety of applications.
In terms of future upgrades, the XCZU47DR-L1FFVE1156I chip model is capable of supporting the latest technologies and protocols, such as 5G, Wi-Fi 6, and Bluetooth 5.0. It is also capable of supporting advanced intelligent scenarios, such as machine learning, artificial intelligence, and natural language processing. It is also capable of providing a high level of security, with support for secure boot, secure storage, and secure communication protocols.
The XCZU47DR-L1FFVE1156I chip model has been tested and validated in a variety of applications and scenarios. It has been used in a number of actual case studies, and has been proven to provide reliable, high-performance communication. In addition, the device has been tested for a variety of potential security vulnerabilities, and has been found to be secure and reliable.
When using the XCZU47DR-L1FFVE1156I chip model, it is important to adhere to the product specifications and design requirements. It is also important to consider the potential security risks associated with the device, and to take appropriate measures to mitigate these risks. In addition, it is important to ensure that the device is properly configured and maintained, and that it is used in accordance with the manufacturer's instructions.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||