XCZU47DR-2FSVE1156I
XCZU47DR-2FSVE1156I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU47DR-2FSVE1156I


XCZU47DR-2FSVE1156I
F20-XCZU47DR-2FSVE1156I
Active
CMOS, FLIPCHIP-1156
FLIPCHIP-1156

XCZU47DR-2FSVE1156I ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XCZU47DR-2FSVE1156I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FLIPCHIP-1156
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Date Of Intro 2019-02-20

XCZU47DR-2FSVE1156I Datasheet Download


XCZU47DR-2FSVE1156I Overview



The Xilinx Zynq UltraScale+ MPSoC (XCZU47DR-2FSVE1156I) is a highly versatile and powerful chip model designed to meet the needs of a wide range of applications. It is a multi-processor system-on-chip (MPSoC) that combines a 64-bit quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, an ARM Mali-400MP2 GPU, and a range of programmable logic. This makes it suitable for a variety of applications, from embedded systems to advanced communication systems.


The Xilinx Zynq UltraScale+ MPSoC has been designed with scalability in mind, meaning that it can be upgraded in the future to include more powerful components. For example, it can be upgraded to include a higher-performance GPU or additional memory. This makes it suitable for use in the future when more powerful components are required.


The Xilinx Zynq UltraScale+ MPSoC is also well-suited for use in advanced communication systems. It has the ability to support a wide range of communication protocols, including Ethernet, USB, CAN, and more. It also supports high-speed data transfer, making it suitable for use in networks where high-speed data transfer is required.


The Xilinx Zynq UltraScale+ MPSoC is also suitable for use in intelligent systems. It has the ability to support machine learning algorithms, making it suitable for use in scenarios where intelligent decision-making is required. It also has the ability to support image processing, making it suitable for use in scenarios where image recognition is required.


In terms of product design, the Xilinx Zynq UltraScale+ MPSoC has been designed to meet a variety of requirements. It has been designed to be robust, meaning that it can withstand a wide range of environmental conditions. It also has low power consumption, meaning that it can be used in battery-powered applications.


In terms of actual case studies, the Xilinx Zynq UltraScale+ MPSoC has been used in a variety of applications, including autonomous driving, medical imaging, and robotics. It has also been used in industrial automation, where it has been used to control industrial machinery.


When using the Xilinx Zynq UltraScale+ MPSoC, it is important to take certain precautions. For example, it is important to ensure that the chip is not exposed to extreme temperatures or high levels of humidity. It is also important to ensure that the chip is not exposed to electromagnetic interference, as this can cause the chip to malfunction.


In conclusion, the Xilinx Zynq UltraScale+ MPSoC (XCZU47DR-2FSVE1156I) is a highly versatile and powerful chip model that is suitable for a variety of applications. It has been designed with scalability in mind, meaning that it can be upgraded in the future to include more powerful components. It is also well-suited for use in advanced communication systems and intelligent systems, as it has the ability to support a wide range of communication protocols and machine learning algorithms. In terms of product design, the chip has been designed to be robust and low power consumption. Finally, it is important to take certain precautions when using the chip, such as ensuring that it is not exposed to extreme temperatures or high levels of humidity.



3,517 In Stock


I want to buy

Unit Price: $25,597.9741
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $23,806.1159 $23,806.1159
10+ $23,550.1362 $235,501.3617
100+ $22,270.2375 $2,227,023.7467
1000+ $20,990.3388 $10,495,169.3810
10000+ $19,198.4806 $19,198,480.5750
The price is for reference only, please refer to the actual quotation!

Quick Quote