
AMD Xilinx
XCZU47DR-2FSVE1156I
XCZU47DR-2FSVE1156I ECAD Model
XCZU47DR-2FSVE1156I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B1156 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 240 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | FLIPCHIP-1156 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Date Of Intro | 2019-02-20 |
XCZU47DR-2FSVE1156I Datasheet Download
XCZU47DR-2FSVE1156I Overview
The Xilinx Zynq UltraScale+ MPSoC (XCZU47DR-2FSVE1156I) is a highly versatile and powerful chip model designed to meet the needs of a wide range of applications. It is a multi-processor system-on-chip (MPSoC) that combines a 64-bit quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, an ARM Mali-400MP2 GPU, and a range of programmable logic. This makes it suitable for a variety of applications, from embedded systems to advanced communication systems.
The Xilinx Zynq UltraScale+ MPSoC has been designed with scalability in mind, meaning that it can be upgraded in the future to include more powerful components. For example, it can be upgraded to include a higher-performance GPU or additional memory. This makes it suitable for use in the future when more powerful components are required.
The Xilinx Zynq UltraScale+ MPSoC is also well-suited for use in advanced communication systems. It has the ability to support a wide range of communication protocols, including Ethernet, USB, CAN, and more. It also supports high-speed data transfer, making it suitable for use in networks where high-speed data transfer is required.
The Xilinx Zynq UltraScale+ MPSoC is also suitable for use in intelligent systems. It has the ability to support machine learning algorithms, making it suitable for use in scenarios where intelligent decision-making is required. It also has the ability to support image processing, making it suitable for use in scenarios where image recognition is required.
In terms of product design, the Xilinx Zynq UltraScale+ MPSoC has been designed to meet a variety of requirements. It has been designed to be robust, meaning that it can withstand a wide range of environmental conditions. It also has low power consumption, meaning that it can be used in battery-powered applications.
In terms of actual case studies, the Xilinx Zynq UltraScale+ MPSoC has been used in a variety of applications, including autonomous driving, medical imaging, and robotics. It has also been used in industrial automation, where it has been used to control industrial machinery.
When using the Xilinx Zynq UltraScale+ MPSoC, it is important to take certain precautions. For example, it is important to ensure that the chip is not exposed to extreme temperatures or high levels of humidity. It is also important to ensure that the chip is not exposed to electromagnetic interference, as this can cause the chip to malfunction.
In conclusion, the Xilinx Zynq UltraScale+ MPSoC (XCZU47DR-2FSVE1156I) is a highly versatile and powerful chip model that is suitable for a variety of applications. It has been designed with scalability in mind, meaning that it can be upgraded in the future to include more powerful components. It is also well-suited for use in advanced communication systems and intelligent systems, as it has the ability to support a wide range of communication protocols and machine learning algorithms. In terms of product design, the chip has been designed to be robust and low power consumption. Finally, it is important to take certain precautions when using the chip, such as ensuring that it is not exposed to extreme temperatures or high levels of humidity.
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3,517 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $23,806.1159 | $23,806.1159 |
10+ | $23,550.1362 | $235,501.3617 |
100+ | $22,270.2375 | $2,227,023.7467 |
1000+ | $20,990.3388 | $10,495,169.3810 |
10000+ | $19,198.4806 | $19,198,480.5750 |
The price is for reference only, please refer to the actual quotation! |