AMD Xilinx
XCZU47DR-2FSVE1156E
XCZU47DR-2FSVE1156E ECAD Model
XCZU47DR-2FSVE1156E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FLIPCHIP-1156 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2019-02-20 |
XCZU47DR-2FSVE1156E Datasheet Download
XCZU47DR-2FSVE1156E Overview
The chip model XCZU47DR-2FSVE1156E is an important development in the chip industry. It is the first of its kind to offer a range of features that make it suitable for a variety of applications. It has a wide range of features such as low power consumption, high performance, and a compact form factor. This makes it ideal for use in a wide range of applications, from consumer electronics to industrial automation.
The chip model XCZU47DR-2FSVE1156E is designed to be highly adaptable and upgradeable. Its modular design makes it easy to upgrade to new technologies and meet the demands of the ever-evolving chip industry. It is designed to be compatible with a variety of communication protocols, allowing it to be used in a wide range of networks and communication systems. This makes it suitable for use in advanced communication systems, such as 5G networks.
The chip model XCZU47DR-2FSVE1156E is also designed to be used in intelligent scenarios. It is capable of supporting a variety of AI technologies, such as deep learning and machine learning. This makes it suitable for use in the era of fully intelligent systems, such as autonomous vehicles and smart homes. It is also capable of supporting a variety of communication protocols, making it suitable for use in a variety of networks, from local area networks to wide area networks.
The chip model XCZU47DR-2FSVE1156E is an important development in the chip industry and is set to revolutionize the way chips are used in a variety of applications. Its highly adaptable design and wide range of features make it suitable for use in a variety of applications, from consumer electronics to industrial automation. Its compatibility with a variety of communication protocols also makes it suitable for use in advanced communication systems, such as 5G networks. Finally, its ability to support a variety of AI technologies makes it suitable for use in the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||