XCZU47DR-2FFVE1156I
XCZU47DR-2FFVE1156I
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rohs

AMD Xilinx

XCZU47DR-2FFVE1156I


XCZU47DR-2FFVE1156I
F20-XCZU47DR-2FFVE1156I
Active
CMOS, FLIPCHIP-1156
FLIPCHIP-1156

XCZU47DR-2FFVE1156I ECAD Model


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XCZU47DR-2FFVE1156I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FLIPCHIP-1156
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Date Of Intro 2019-02-20

XCZU47DR-2FFVE1156I Datasheet Download


XCZU47DR-2FFVE1156I Overview



The XCZU47DR-2FFVE1156I is a powerful chip model designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL (Hardware Description Language) language, which allows for the rapid development of complex applications.


The XCZU47DR-2FFVE1156I is a highly versatile chip model that can be used in a variety of applications. It is capable of handling large amounts of data quickly and efficiently, making it ideal for applications that require high-speed performance. It is also capable of handling complex algorithms with ease, making it perfect for image processing and embedded processing applications.


The XCZU47DR-2FFVE1156I is a cutting-edge chip model that is paving the way for the future of digital signal processing. As the demand for faster and more efficient digital signal processing grows, the XCZU47DR-2FFVE1156I is perfectly positioned to meet these needs. It is also capable of supporting new technologies that may be required for specific application environments.


In order to make use of the XCZU47DR-2FFVE1156I, it is important to understand the product description and design requirements. This includes the types of applications that the chip model is capable of handling, as well as any special requirements that may be necessary for specific applications. It is also important to understand the actual case studies and precautions that should be taken when using the chip model.


The XCZU47DR-2FFVE1156I is a powerful chip model that is perfectly suited for high-performance digital signal processing, embedded processing, and image processing. With its ability to handle complex algorithms and its support for new technologies, it is well-positioned to meet the demands of the future. By understanding the product description and design requirements, as well as any special precautions that may be necessary, users of the XCZU47DR-2FFVE1156I can ensure that they are taking full advantage of its capabilities.



3,128 In Stock


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Unit Price: $66,277.9769
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $61,638.5185 $61,638.5185
10+ $60,975.7387 $609,757.3875
100+ $57,661.8399 $5,766,183.9903
1000+ $54,347.9411 $27,173,970.5290
10000+ $49,708.4827 $49,708,482.6750
The price is for reference only, please refer to the actual quotation!

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