AMD Xilinx
XCZU47DR-1FFVE1156I
XCZU47DR-1FFVE1156I ECAD Model
XCZU47DR-1FFVE1156I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FLIPCHIP-1156 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2019-02-20 |
XCZU47DR-1FFVE1156I Datasheet Download
XCZU47DR-1FFVE1156I Overview
The chip model XCZU47DR-1FFVE1156I is a powerful and reliable device that is becoming increasingly popular in various industries. It is designed to provide high-performance, low-power solutions for a variety of applications. It is based on the Xilinx UltraScale+ FPGA architecture, which enables advanced features such as high-speed signal processing and high-speed memory access. The chip model is also equipped with a range of peripherals, such as DDR4, QSPI, and Ethernet, which makes it suitable for a variety of applications.
The advantages of the chip model XCZU47DR-1FFVE1156I include its high-performance, low-power consumption, and advanced features. It is also highly reliable, making it suitable for use in a wide range of applications. It is also highly flexible, allowing for easy customization and integration with other components. The chip model is also very cost-effective, making it an attractive option for many industries.
The expected demand trends for the chip model XCZU47DR-1FFVE1156I in the future are positive. As the technology continues to advance and improve, the demand for the chip model is expected to increase. This is due to its high performance, low power consumption, and advanced features. It is also expected to be used in more advanced applications, such as robotics, communications, and artificial intelligence.
The original design intention of the chip model XCZU47DR-1FFVE1156I was to provide a high-performance, low-power solution for a variety of applications. Its advanced features make it suitable for a wide range of applications, from communications to robotics. The chip model is also highly reliable and cost-effective, making it an attractive option for many industries.
The possibility of future upgrades for the chip model XCZU47DR-1FFVE1156I is high. As technology continues to advance and improve, the chip model can be upgraded to take advantage of new features and capabilities. This will allow it to be used in more advanced applications and provide more efficient solutions.
The chip model XCZU47DR-1FFVE1156I can be applied to the development and popularization of future intelligent robots. The chip model’s advanced features and low power consumption make it ideal for use in robotics applications. It can be used to control and monitor robots, as well as to provide advanced features such as vision and navigation. To use the chip model effectively, technical talents such as software engineers, hardware engineers, and robotics experts are needed.
In conclusion, the chip model XCZU47DR-1FFVE1156I is a powerful and reliable device that is becoming increasingly popular in various industries. It is designed to provide high-performance, low-power solutions for a variety of applications. It is highly reliable, cost-effective, and flexible, making it an attractive option for many industries. The chip model can also be upgraded to take advantage of new features and capabilities. Furthermore, it can be applied to the development and popularization of future intelligent robots, and technical talents such as software engineers, hardware engineers, and robotics experts are needed to use the model effectively.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||