XCZU47DR-1FFVE1156E
XCZU47DR-1FFVE1156E
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rohs

AMD Xilinx

XCZU47DR-1FFVE1156E


XCZU47DR-1FFVE1156E
F20-XCZU47DR-1FFVE1156E
Active
CMOS, FLIPCHIP-1156
FLIPCHIP-1156

XCZU47DR-1FFVE1156E ECAD Model


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XCZU47DR-1FFVE1156E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FLIPCHIP-1156
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Date Of Intro 2019-02-20

XCZU47DR-1FFVE1156E Datasheet Download


XCZU47DR-1FFVE1156E Overview



The XCZU47DR-1FFVE1156E chip model is a powerful, high-performance, low-power, and low-cost solution for advanced communication systems. It was designed with the intention of providing a cost-effective, reliable, and efficient way to connect devices, networks, and systems. The model is equipped with a wide range of features, including high-speed data processing, powerful memory, and efficient power management.


The XCZU47DR-1FFVE1156E chip model is capable of supporting multiple communication protocols, making it suitable for a wide range of applications. It can be used to create advanced networks and intelligent scenarios, such as smart homes, smart cities, and intelligent transportation systems. The model is also suitable for the development and popularization of future intelligent robots, since it is capable of supporting a wide range of sensors, actuators, and controllers.


The XCZU47DR-1FFVE1156E chip model is also capable of being upgraded to meet the changing needs of future networks and intelligent systems. The model can be upgraded with new features and capabilities to enable it to handle more complex tasks and data processing. The model is also capable of being used in the era of fully intelligent systems, as it is designed to be highly scalable and flexible.


In order to use the XCZU47DR-1FFVE1156E chip model effectively, engineers and developers need to have a good understanding of the underlying technologies and protocols. They should also be familiar with the architecture of the model and its capabilities. Additionally, they should be knowledgeable about the various software and hardware components that are necessary for the model to function properly. By understanding the model and its capabilities, engineers and developers can create powerful and efficient networks and systems that can be used to develop and popularize intelligent robots.



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