
AMD Xilinx
XCZU47DR-1FFVE1156E
XCZU47DR-1FFVE1156E ECAD Model
XCZU47DR-1FFVE1156E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B1156 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | FLIPCHIP-1156 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Date Of Intro | 2019-02-20 |
XCZU47DR-1FFVE1156E Datasheet Download
XCZU47DR-1FFVE1156E Overview
The XCZU47DR-1FFVE1156E chip model is a powerful, high-performance, low-power, and low-cost solution for advanced communication systems. It was designed with the intention of providing a cost-effective, reliable, and efficient way to connect devices, networks, and systems. The model is equipped with a wide range of features, including high-speed data processing, powerful memory, and efficient power management.
The XCZU47DR-1FFVE1156E chip model is capable of supporting multiple communication protocols, making it suitable for a wide range of applications. It can be used to create advanced networks and intelligent scenarios, such as smart homes, smart cities, and intelligent transportation systems. The model is also suitable for the development and popularization of future intelligent robots, since it is capable of supporting a wide range of sensors, actuators, and controllers.
The XCZU47DR-1FFVE1156E chip model is also capable of being upgraded to meet the changing needs of future networks and intelligent systems. The model can be upgraded with new features and capabilities to enable it to handle more complex tasks and data processing. The model is also capable of being used in the era of fully intelligent systems, as it is designed to be highly scalable and flexible.
In order to use the XCZU47DR-1FFVE1156E chip model effectively, engineers and developers need to have a good understanding of the underlying technologies and protocols. They should also be familiar with the architecture of the model and its capabilities. Additionally, they should be knowledgeable about the various software and hardware components that are necessary for the model to function properly. By understanding the model and its capabilities, engineers and developers can create powerful and efficient networks and systems that can be used to develop and popularize intelligent robots.
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Pricing (USD)
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