AMD Xilinx
XCV812E-8FG900I
XCV812E-8FG900I ECAD Model
XCV812E-8FG900I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 556 | |
| Number of Outputs | 556 | |
| Number of Logic Cells | 21168 | |
| Number of Equivalent Gates | 254016 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 254016 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, FBGA-900 | |
| Pin Count | 900 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV812E-8FG900I Datasheet Download
XCV812E-8FG900I Overview
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The chip model XCV812E-8FG900I has the potential to revolutionize the way we interact with machines and can be used to create more efficient and powerful networks and intelligent systems. With its powerful capabilities, the chip is sure to be a major player in the future of the tech industry. With the right technical talents and the right application environment, the chip model XCV812E-8FG900I can be used to create a more intelligent and efficient future.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||