XCV812E-7FG900I
XCV812E-7FG900I
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rohs

AMD Xilinx

XCV812E-7FG900I


XCV812E-7FG900I
F20-XCV812E-7FG900I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PLASTIC, FBGA-900
PLASTIC, FBGA-900

XCV812E-7FG900I ECAD Model


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XCV812E-7FG900I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 556
Number of Outputs 556
Number of Logic Cells 21168
Number of Equivalent Gates 254016
Number of CLBs 4704
Combinatorial Delay of a CLB-Max 420 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 4704 CLBS, 254016 GATES
Clock Frequency-Max 400 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B900
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 31 mm
Length 31 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description PLASTIC, FBGA-900
Pin Count 900
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

XCV812E-7FG900I Datasheet Download


XCV812E-7FG900I Overview



The chip model XCV812E-7FG900I is a cutting-edge technology developed by a leading semiconductor company. It has a number of advantages over other similar models, including high speed, low power consumption, and a wide range of features. This chip model is expected to be increasingly in demand in the near future, particularly in the fields of network, computing and communication.


The chip model XCV812E-7FG900I is designed to be used in a variety of intelligent scenarios. It is capable of performing complex calculations and tasks quickly and efficiently, making it an ideal choice for the development of intelligent systems. The chip model can be used in networks to enable faster data transfer and communication, as well as to improve the speed of processing and analysis. It can also be used to enable intelligent robots to perform complex tasks, such as navigation and object recognition.


In order to use the chip model XCV812E-7FG900I effectively, a number of technical skills are required. These include knowledge of computer hardware, software, networks, and programming languages. Additionally, the chip model requires a good understanding of the principles of artificial intelligence and machine learning. This knowledge is necessary to ensure that the chip model is used correctly and to its full potential.


The chip model XCV812E-7FG900I offers a number of advantages and is expected to be increasingly in demand in the near future. It is capable of performing complex calculations and tasks quickly and efficiently, making it an ideal choice for the development of intelligent systems. With the right technical skills, the chip model can be used to enable intelligent robots to perform complex tasks, such as navigation and object recognition. As the demand for intelligent systems continues to increase, the chip model XCV812E-7FG900I is sure to become an important part of the future of technology.



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QTY Unit Price Ext Price
1+ $491.7185 $491.7185
10+ $486.4312 $4,864.3123
100+ $459.9948 $45,999.4752
1000+ $433.5583 $216,779.1360
10000+ $396.5472 $396,547.2000
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