
AMD Xilinx
XCV812E-7FG900I
XCV812E-7FG900I ECAD Model
XCV812E-7FG900I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 556 | |
Number of Outputs | 556 | |
Number of Logic Cells | 21168 | |
Number of Equivalent Gates | 254016 | |
Number of CLBs | 4704 | |
Combinatorial Delay of a CLB-Max | 420 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4704 CLBS, 254016 GATES | |
Clock Frequency-Max | 400 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B900 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA900,30X30,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 31 mm | |
Length | 31 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | PLASTIC, FBGA-900 | |
Pin Count | 900 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
XCV812E-7FG900I Datasheet Download
XCV812E-7FG900I Overview
The chip model XCV812E-7FG900I is a cutting-edge technology developed by a leading semiconductor company. It has a number of advantages over other similar models, including high speed, low power consumption, and a wide range of features. This chip model is expected to be increasingly in demand in the near future, particularly in the fields of network, computing and communication.
The chip model XCV812E-7FG900I is designed to be used in a variety of intelligent scenarios. It is capable of performing complex calculations and tasks quickly and efficiently, making it an ideal choice for the development of intelligent systems. The chip model can be used in networks to enable faster data transfer and communication, as well as to improve the speed of processing and analysis. It can also be used to enable intelligent robots to perform complex tasks, such as navigation and object recognition.
In order to use the chip model XCV812E-7FG900I effectively, a number of technical skills are required. These include knowledge of computer hardware, software, networks, and programming languages. Additionally, the chip model requires a good understanding of the principles of artificial intelligence and machine learning. This knowledge is necessary to ensure that the chip model is used correctly and to its full potential.
The chip model XCV812E-7FG900I offers a number of advantages and is expected to be increasingly in demand in the near future. It is capable of performing complex calculations and tasks quickly and efficiently, making it an ideal choice for the development of intelligent systems. With the right technical skills, the chip model can be used to enable intelligent robots to perform complex tasks, such as navigation and object recognition. As the demand for intelligent systems continues to increase, the chip model XCV812E-7FG900I is sure to become an important part of the future of technology.
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3,577 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $491.7185 | $491.7185 |
10+ | $486.4312 | $4,864.3123 |
100+ | $459.9948 | $45,999.4752 |
1000+ | $433.5583 | $216,779.1360 |
10000+ | $396.5472 | $396,547.2000 |
The price is for reference only, please refer to the actual quotation! |