XCV812E-6FG900I
XCV812E-6FG900I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCV812E-6FG900I


XCV812E-6FG900I
F20-XCV812E-6FG900I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PLASTIC, FBGA-900
PLASTIC, FBGA-900

XCV812E-6FG900I ECAD Model


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XCV812E-6FG900I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 556
Number of Outputs 556
Number of Logic Cells 21168
Number of Equivalent Gates 254016
Number of CLBs 4704
Combinatorial Delay of a CLB-Max 470 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 4704 CLBS, 254016 GATES
Clock Frequency-Max 357 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B900
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 31 mm
Length 31 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description PLASTIC, FBGA-900
Pin Count 900
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

XCV812E-6FG900I Datasheet Download


XCV812E-6FG900I Overview



The XCV812E-6FG900I chip model is a highly advanced and versatile product that has been designed to meet the needs of today’s rapidly evolving technology landscape. It offers a wide range of features that make it an ideal choice for a variety of applications, including network and intelligent system scenarios.


The XCV812E-6FG900I chip model is equipped with a powerful processor and a high-speed memory interface. This allows it to quickly process and store large amounts of data, making it an ideal choice for applications that require fast, reliable performance. It also has a wide range of advanced features, such as support for multiple operating systems, advanced security measures, and support for multiple communication protocols. This makes it an ideal choice for applications that require high levels of security and reliability.


In addition to its impressive performance, the XCV812E-6FG900I chip model is also designed with a range of features that make it well-suited to the current and future demand trends in the industry. It is designed to be able to handle a wide range of tasks, from simple data processing and storage to more complex tasks such as machine learning and artificial intelligence. This makes it an ideal choice for applications that require the ability to quickly and accurately process large amounts of data.


The XCV812E-6FG900I chip model also has a range of features that make it an ideal choice for applications in the era of fully intelligent systems. It is designed to be able to handle a wide range of tasks, from simple data processing and storage to more complex tasks such as machine learning and artificial intelligence. This makes it an ideal choice for applications that require the ability to quickly and accurately process large amounts of data.


The XCV812E-6FG900I chip model also has a range of features that make it an ideal choice for applications in the era of fully intelligent systems. It is designed to be able to handle a wide range of tasks, from simple data processing and storage to more complex tasks such as machine learning and artificial intelligence. This makes it an ideal choice for applications that require the ability to quickly and accurately process large amounts of data.


When it comes to product design, the XCV812E-6FG900I chip model is designed to meet the specific requirements of the industry. It is designed to be able to handle a wide range of tasks, from simple data processing and storage to more complex tasks such as machine learning and artificial intelligence. It also has a range of advanced features, such as support for multiple operating systems, advanced security measures, and support for multiple communication protocols. This makes it an ideal choice for applications that require high levels of security and reliability.


In addition to its impressive performance and design, the XCV812E-6FG900I chip model also has a range of features that make it well-suited to the current and future demand trends in the industry. It is designed to be able to handle a wide range of tasks, from simple data processing and storage to more complex tasks such as machine learning and artificial intelligence. This makes it an ideal choice for applications that require the ability to quickly and accurately process large amounts of data.


When it comes to actual case studies and precautions, the XCV812E-6FG900I chip model is designed to be robust and reliable. It is designed to be able to handle a wide range of tasks, from simple data processing and storage to more complex tasks such as machine learning and artificial intelligence. This makes it an ideal choice for applications that require the ability to quickly and accurately process large amounts of data. It also has a range of advanced features, such as support for multiple operating systems, advanced security measures, and support for multiple communication protocols. This makes it an ideal choice for applications that require high levels of security and reliability.


The XCV812E-6FG900I chip model is an impressive product that is designed to meet the specific needs of today’s rapidly evolving technology landscape. It offers a wide range of features that make it an ideal choice for a variety of applications, including network and intelligent system scenarios. It is also designed to be able to handle a wide range of tasks, from simple data processing and storage to more complex tasks such as machine learning and artificial intelligence. This makes it an ideal choice for applications that require the ability to quickly and accurately process large amounts of data. In addition, it is designed to be robust and reliable, making it an ideal choice for applications that require high levels of security and reliability.



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