
AMD Xilinx
XCV812E-6FG900I
XCV812E-6FG900I ECAD Model
XCV812E-6FG900I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 556 | |
Number of Outputs | 556 | |
Number of Logic Cells | 21168 | |
Number of Equivalent Gates | 254016 | |
Number of CLBs | 4704 | |
Combinatorial Delay of a CLB-Max | 470 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4704 CLBS, 254016 GATES | |
Clock Frequency-Max | 357 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B900 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA900,30X30,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 31 mm | |
Length | 31 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | PLASTIC, FBGA-900 | |
Pin Count | 900 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
XCV812E-6FG900I Datasheet Download
XCV812E-6FG900I Overview
The XCV812E-6FG900I chip model is a highly advanced and versatile product that has been designed to meet the needs of today’s rapidly evolving technology landscape. It offers a wide range of features that make it an ideal choice for a variety of applications, including network and intelligent system scenarios.
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The XCV812E-6FG900I chip model also has a range of features that make it an ideal choice for applications in the era of fully intelligent systems. It is designed to be able to handle a wide range of tasks, from simple data processing and storage to more complex tasks such as machine learning and artificial intelligence. This makes it an ideal choice for applications that require the ability to quickly and accurately process large amounts of data.
The XCV812E-6FG900I chip model also has a range of features that make it an ideal choice for applications in the era of fully intelligent systems. It is designed to be able to handle a wide range of tasks, from simple data processing and storage to more complex tasks such as machine learning and artificial intelligence. This makes it an ideal choice for applications that require the ability to quickly and accurately process large amounts of data.
When it comes to product design, the XCV812E-6FG900I chip model is designed to meet the specific requirements of the industry. It is designed to be able to handle a wide range of tasks, from simple data processing and storage to more complex tasks such as machine learning and artificial intelligence. It also has a range of advanced features, such as support for multiple operating systems, advanced security measures, and support for multiple communication protocols. This makes it an ideal choice for applications that require high levels of security and reliability.
In addition to its impressive performance and design, the XCV812E-6FG900I chip model also has a range of features that make it well-suited to the current and future demand trends in the industry. It is designed to be able to handle a wide range of tasks, from simple data processing and storage to more complex tasks such as machine learning and artificial intelligence. This makes it an ideal choice for applications that require the ability to quickly and accurately process large amounts of data.
When it comes to actual case studies and precautions, the XCV812E-6FG900I chip model is designed to be robust and reliable. It is designed to be able to handle a wide range of tasks, from simple data processing and storage to more complex tasks such as machine learning and artificial intelligence. This makes it an ideal choice for applications that require the ability to quickly and accurately process large amounts of data. It also has a range of advanced features, such as support for multiple operating systems, advanced security measures, and support for multiple communication protocols. This makes it an ideal choice for applications that require high levels of security and reliability.
The XCV812E-6FG900I chip model is an impressive product that is designed to meet the specific needs of today’s rapidly evolving technology landscape. It offers a wide range of features that make it an ideal choice for a variety of applications, including network and intelligent system scenarios. It is also designed to be able to handle a wide range of tasks, from simple data processing and storage to more complex tasks such as machine learning and artificial intelligence. This makes it an ideal choice for applications that require the ability to quickly and accurately process large amounts of data. In addition, it is designed to be robust and reliable, making it an ideal choice for applications that require high levels of security and reliability.
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