AMD Xilinx
XCR3256XL-12CSG280I
XCR3256XL-12CSG280I ECAD Model
XCR3256XL-12CSG280I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 12 ns | |
| Number of Macro Cells | 256 | |
| Number of I/O Lines | 164 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 164 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 88 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3/3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 2.7 V | |
| JESD-30 Code | S-PBGA-B280 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 280 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA280,19X19,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 16 mm | |
| Length | 16 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 0.80 MM PITCH, LEAD FREE, CSP-280 | |
| Pin Count | 280 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCR3256XL-12CSG280I Datasheet Download
XCR3256XL-12CSG280I Overview
The XCR3256XL-12CSG280I chip model was designed with the intention of providing a reliable, efficient and cost-effective solution for modern communication systems. This chip model has a wide range of applications and can be used for various purposes such as data transmission, wireless communication, and network security. It is also capable of being upgraded to meet the demands of the ever-evolving communication systems.
The XCR3256XL-12CSG280I chip model is also suitable for advanced communication systems. It is capable of providing high-speed data transmission and can be used in a variety of intelligent scenarios. Its features such as low power consumption, low latency, and high bandwidth make it an ideal choice for modern communication networks. Furthermore, it can be used in the era of fully intelligent systems, as it can be integrated into various kinds of intelligent robots and machines.
The XCR3256XL-12CSG280I chip model can also be used in the development and popularization of future intelligent robots. It is equipped with powerful processing capabilities, which can be used to control the functioning of a robot. Furthermore, it can be used to create and manage complex algorithms that can be used to control the robot’s movements and actions. In order to use the chip model effectively, technical knowledge and skills such as programming and computer engineering are required.
Overall, the XCR3256XL-12CSG280I chip model is an ideal choice for modern communication systems, as it is capable of providing high-speed data transmission and can be used in a variety of intelligent scenarios. It is also suitable for use in the development and popularization of future intelligent robots, and technical knowledge and skills are required to use the model effectively.
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1,481 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $21.6505 | $21.6505 |
| 10+ | $21.4177 | $214.1769 |
| 100+ | $20.2537 | $2,025.3687 |
| 1000+ | $19.0897 | $9,544.8410 |
| 10000+ | $17.4601 | $17,460.0750 |
| The price is for reference only, please refer to the actual quotation! | ||