AMD Xilinx
XCR3256XL-12CSG280C
XCR3256XL-12CSG280C ECAD Model
XCR3256XL-12CSG280C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 12 ns | |
| Number of Macro Cells | 256 | |
| Number of I/O Lines | 164 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 164 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 88 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B280 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 280 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA280,19X19,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 16 mm | |
| Length | 16 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 0.80 MM PITCH, LEAD FREE, CSP-280 | |
| Pin Count | 280 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCR3256XL-12CSG280C Datasheet Download
XCR3256XL-12CSG280C Overview
The XCR3256XL-12CSG280C chip model is an advanced integrated circuit from Xilinx, Inc., a leading provider of programmable logic solutions. The model was designed with the intention of providing a low-cost, high-performance solution for a wide range of applications. It features an efficient 12-bit architecture with a power-efficient core and a wide range of peripherals.
The model is suitable for use in a variety of communication systems, such as cellular networks, Wi-Fi networks, and Bluetooth networks. It can also be used to develop advanced network applications such as network security, network monitoring, and network optimization. Additionally, it can be used to develop intelligent scenarios such as artificial intelligence, machine learning, and natural language processing.
The chip model is also suitable for use in the development and popularization of future intelligent robots. It offers a wide range of features and functions that can be used to create sophisticated robotic systems. In order to use the model effectively, technical talents such as software developers, hardware engineers, and robotics experts are needed.
The XCR3256XL-12CSG280C chip model is a flexible and powerful solution that can be used in a wide range of applications. It is capable of supporting future upgrades, making it an ideal choice for use in the era of fully intelligent systems. With the right technical expertise, it can be used to create sophisticated intelligent robots that can be used in a variety of scenarios.
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2,965 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $17.2982 | $17.2982 |
| 10+ | $17.1122 | $171.1218 |
| 100+ | $16.1822 | $1,618.2174 |
| 1000+ | $15.2522 | $7,626.0820 |
| 10000+ | $13.9502 | $13,950.1500 |
| The price is for reference only, please refer to the actual quotation! | ||