AMD Xilinx
XCR3256XL-10CSG280C
XCR3256XL-10CSG280C ECAD Model
XCR3256XL-10CSG280C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 10 ns | |
| Number of Macro Cells | 256 | |
| Number of I/O Lines | 164 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 164 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 105 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B280 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 280 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA280,19X19,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 16 mm | |
| Length | 16 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 0.80 MM PITCH, LEAD FREE, CSP-280 | |
| Pin Count | 280 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCR3256XL-10CSG280C Datasheet Download
XCR3256XL-10CSG280C Overview
The XCR3256XL-10CSG280C chip model is an advanced integrated circuit (IC) developed by a leading semiconductor company. It is an ultra-low power and low-cost solution that is ideal for a range of applications, from industrial to consumer electronics. This chip model is designed to provide high performance, low power consumption, and cost-efficiency. It is also highly reliable and robust, making it suitable for a wide range of applications.
The XCR3256XL-10CSG280C chip model is designed for use in a variety of communication systems, such as cellular and wireless networks, as well as in advanced communication systems. It is capable of providing high-speed data transfers, low latency, and high-quality audio and video streaming. It is also capable of supporting advanced technologies, such as 4G LTE, 5G, and Wi-Fi. Furthermore, it is also designed to be compatible with a variety of different operating systems, including Windows, Linux, and Android.
The XCR3256XL-10CSG280C chip model is expected to be in high demand in the future, as it is suitable for a wide range of applications. It is ideal for use in industrial, automotive, and consumer electronics, as well as in advanced communication systems. It is also suitable for use in a variety of networks, such as cellular and wireless networks. Furthermore, it is also suitable for use in intelligent scenarios, such as the Internet of Things (IoT).
The XCR3256XL-10CSG280C chip model is designed with the possibility of future upgrades in mind. It is designed to be able to handle the demands of the future, such as higher data rates, more efficient power consumption, and better performance. In addition, it is also designed to be able to support advanced technologies, such as 5G and Wi-Fi. Furthermore, it is also designed to be able to handle the demands of the future, such as the era of fully intelligent systems.
The XCR3256XL-10CSG280C chip model is a highly versatile and reliable chip model. It is designed to be suitable for a wide range of applications, from industrial to consumer electronics, and from advanced communication systems to intelligent scenarios. It is designed to be able to handle the demands of the future, such as higher data rates, more efficient power consumption, and better performance. In addition, it is also designed to be able to support advanced technologies, such as 5G and Wi-Fi. It is also designed to be able to handle the demands of the future, such as the era of fully intelligent systems. Therefore, the XCR3256XL-10CSG280C chip model is expected to be in high demand in the future and will be an invaluable tool for a variety of applications.
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3,732 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $22.4689 | $22.4689 |
| 10+ | $22.2273 | $222.2729 |
| 100+ | $21.0193 | $2,101.9287 |
| 1000+ | $19.8113 | $9,905.6410 |
| 10000+ | $18.1201 | $18,120.0750 |
| The price is for reference only, please refer to the actual quotation! | ||