AMD Xilinx
XC7VX980T-L2FFG1928E
XC7VX980T-L2FFG1928E ECAD Model
XC7VX980T-L2FFG1928E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 480 | |
| Number of Outputs | 480 | |
| Number of Logic Cells | 979200 | |
| Number of CLBs | 76500 | |
| Combinatorial Delay of a CLB-Max | 610 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 76500 CLBS | |
| Clock Frequency-Max | 1.818 GHz | |
| Power Supplies | 1,1.8 V | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 970 mV | |
| JESD-30 Code | S-PBGA-B1928 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1928 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1924,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.65 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | FBGA-1928 | |
| Pin Count | 1928 | |
| ECCN Code | 3A001.A.7.B |
XC7VX980T-L2FFG1928E Datasheet Download
XC7VX980T-L2FFG1928E Overview
The XC7VX980T-L2FFG1928E chip model is a powerful and versatile model that has been designed to meet the needs of the modern world. It is a high performance, low power, and cost-effective solution for a variety of applications in the industry. It is a multi-core processor that is capable of handling multiple tasks simultaneously, allowing for higher levels of efficiency and performance. With its advanced features, it can be used in a variety of industries, such as automotive, medical, and industrial automation.
The XC7VX980T-L2FFG1928E chip model offers several advantages over other models. It is equipped with a variety of hardware and software features, such as a high-speed processor, a large memory capacity, and a wide range of I/O ports. It also supports the latest communication protocols, such as Bluetooth, Wi-Fi, and Ethernet. In addition, it can be used in a variety of applications, including embedded systems, embedded devices, and industrial automation.
The XC7VX980T-L2FFG1928E chip model is expected to be in high demand in the future. As the world becomes increasingly connected, the demand for high-performance, low-power, and cost-effective solutions will only increase. The XC7VX980T-L2FFG1928E chip model is well-suited for this purpose, as it is capable of handling multiple tasks simultaneously, allowing for higher levels of efficiency and performance.
The original design intention of the XC7VX980T-L2FFG1928E chip model was to provide a powerful and versatile solution for use in a variety of industries. The model is designed to be easily upgradable, allowing for future upgrades to be made with minimal effort. This makes it an ideal solution for use in advanced communication systems, as it can easily be adapted to meet the changing needs of the industry.
The XC7VX980T-L2FFG1928E chip model is also suitable for use in networks and intelligent systems. Its advanced features make it perfect for use in a variety of scenarios, such as smart homes, industrial automation, and autonomous vehicles. It is also capable of being used in the era of fully intelligent systems, as its features make it well-suited for use in artificial intelligence and machine learning applications.
Overall, the XC7VX980T-L2FFG1928E chip model is a powerful and versatile solution that can be used in a variety of industries and applications. Its advanced features make it ideal for use in advanced communication systems, networks, and intelligent systems. With its upgradable design and wide range of features, it is expected to be in high demand in the future and is well-suited for use in the era of fully intelligent systems.
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| QTY | Unit Price | Ext Price |
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