AMD Xilinx
XC7VX980T-1FFG1928C
XC7VX980T-1FFG1928C ECAD Model
XC7VX980T-1FFG1928C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 480 | |
| Number of Outputs | 480 | |
| Number of Logic Cells | 979200 | |
| Number of CLBs | 76500 | |
| Combinatorial Delay of a CLB-Max | 740 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 76500 CLBS | |
| Clock Frequency-Max | 1.818 GHz | |
| Power Supplies | 0.9,1.8 V | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 970 mV | |
| JESD-30 Code | S-PBGA-B1928 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1928 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1924,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.65 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1928 | |
| Pin Count | 1928 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.7.B |
XC7VX980T-1FFG1928C Datasheet Download
XC7VX980T-1FFG1928C Overview
The XC7VX980T-1FFG1928C chip model is an advanced, high-performance, multi-purpose chip designed for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language.
The original design intention of the XC7VX980T-1FFG1928C chip model was to provide a powerful, reliable, and cost-effective solution for a variety of applications. It is designed with a high degree of flexibility and offers the possibility of future upgrades. This means that the chip can be adapted to meet the specific needs of each application.
The XC7VX980T-1FFG1928C chip model is also suitable for advanced communication systems. It is designed to provide reliable and secure data transmission, as well as to reduce latency and jitter. It also supports a wide range of protocols and standards, including Ethernet, Wi-Fi, Bluetooth, and Zigbee.
The product description of the XC7VX980T-1FFG1928C chip model includes a wide range of features and capabilities. It is designed to provide a high degree of flexibility and scalability, allowing users to customize their system to meet their specific requirements. It also includes a variety of safety features and a robust security system.
When designing with the XC7VX980T-1FFG1928C chip model, it is important to consider the specific requirements of the application. This includes the type of data being processed, the type of communication being used, and the power consumption of the system. It is also important to consider the environment in which the chip is being used, as well as any potential hazards or risks.
There are a number of case studies and success stories of the XC7VX980T-1FFG1928C chip model in use. These stories provide valuable insight into the design and implementation of the chip, and can help to inform the design process. Additionally, there are a number of precautions that should be taken when using the chip, including proper handling and storage, as well as avoiding exposure to extreme temperatures and humidity.
In conclusion, the XC7VX980T-1FFG1928C chip model is an advanced, high-performance, multi-purpose chip designed for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is also suitable for advanced communication systems, and provides a high level of flexibility and scalability. When designing with the chip, it is important to consider the specific requirements of the application, as well as any potential hazards or risks. Additionally, there are a number of case studies and success stories that can provide valuable insight into the design and implementation of the chip.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||