AMD Xilinx
XC7VX980T-2FFG1928C
XC7VX980T-2FFG1928C ECAD Model
XC7VX980T-2FFG1928C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 480 | |
| Number of Outputs | 480 | |
| Number of Logic Cells | 979200 | |
| Number of CLBs | 76500 | |
| Combinatorial Delay of a CLB-Max | 610 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 76500 CLBS | |
| Clock Frequency-Max | 1.818 GHz | |
| Power Supplies | 1,1.8 V | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 970 mV | |
| JESD-30 Code | S-PBGA-B1928 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1928 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1924,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.65 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1928 | |
| Pin Count | 1928 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.B | |
| HTS Code | 8542.39.00.01 |
XC7VX980T-2FFG1928C Datasheet Download
XC7VX980T-2FFG1928C Overview
The XC7VX980T-2FFG1928C chip model is an advanced integrated circuit manufactured by Xilinx, Inc. It is designed to provide a high-performance, low-power solution for applications in a wide range of industries, such as medical, automotive, industrial, and networking.
The XC7VX980T-2FFG1928C chip model offers several advantages, including an ultra-low power consumption of only 0.7W, a high-speed, high-performance architecture, and a wide range of features and options. It is also designed with a high-speed memory interface and a wide range of I/O options, making it an ideal choice for applications in a variety of industries.
The XC7VX980T-2FFG1928C chip model is designed to be highly scalable, allowing for future upgrades and modifications. It is also designed to be compatible with a variety of communication systems, making it a great choice for applications in advanced communication systems.
The XC7VX980T-2FFG1928C chip model is expected to be in high demand in the future, as it provides a wide range of features and options at a low power consumption. It is also expected to be used in a variety of industries, as it is designed to be highly scalable and compatible with a variety of communication systems.
In terms of industry trends, the XC7VX980T-2FFG1928C chip model is expected to be in high demand in the future. It is also expected to be used in a variety of industries, as it is designed to be highly scalable and compatible with a variety of communication systems. Additionally, the chip model may require the support of new technologies in order to be applied in advanced communication systems.
Overall, the XC7VX980T-2FFG1928C chip model is an ideal choice for a wide range of applications, as it offers a high-performance, low-power solution at a low cost. It is expected to be in high demand in the future, as it is designed to be highly scalable and compatible with a variety of communication systems. Additionally, it may require the support of new technologies in order to be applied in advanced communication systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||