AMD Xilinx
XC6VHX380T-1FFG1155I
XC6VHX380T-1FFG1155I ECAD Model
XC6VHX380T-1FFG1155I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 440 | |
| Number of Outputs | 440 | |
| Number of Logic Cells | 382464 | |
| Combinatorial Delay of a CLB-Max | 5.08 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1155 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1155 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1155,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, LEAD FREE, FBGA-1155 | |
| Pin Count | 1155 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VHX380T-1FFG1155I Datasheet Download
XC6VHX380T-1FFG1155I Overview
The chip model XC6VHX380T-1FFG1155I is a high-performance, low-power FPGA from Xilinx. It is designed for a wide range of applications, from high-speed networking to digital signal processing. It has a wide range of features, including a high-speed transceiver, a multi-gigabit transceiver, and a variety of memory and logic blocks. It is a highly flexible, powerful, and efficient FPGA that can be used to implement complex systems.
The chip model XC6VHX380T-1FFG1155I is designed to be upgradeable, so it can be used in the future for more advanced applications. It is capable of supporting the latest technologies, including 5G, Wi-Fi 6, and the next generation of high-speed networking. It can also be used in advanced communication systems, such as those used in autonomous vehicles, drones, and other intelligent systems.
The chip model XC6VHX380T-1FFG1155I is a powerful, low-power FPGA that can be used for a variety of applications. It can be used for high-speed networking, digital signal processing, and a variety of other applications. It is capable of supporting the latest technologies, including 5G, Wi-Fi 6, and the next generation of high-speed networking. It is also capable of being used in advanced communication systems and in the era of fully intelligent systems.
The chip model XC6VHX380T-1FFG1155I is a powerful, low-power FPGA that is designed to be upgradeable and is capable of supporting the latest technologies. It is the perfect choice for a wide variety of applications, from high-speed networking to digital signal processing. It can be used in advanced communication systems, such as those used in autonomous vehicles, drones, and other intelligent systems. It is also capable of being used in the era of fully intelligent systems.
The chip model XC6VHX380T-1FFG1155I is a powerful, low-power FPGA that can be used for a variety of applications. It is designed to be upgradeable, so it can be used in the future for more advanced applications. It is capable of supporting the latest technologies, including 5G, Wi-Fi 6, and the next generation of high-speed networking. It can also be used in advanced communication systems, such as those used in autonomous vehicles, drones, and other intelligent systems. It is also capable of being used in the era of fully intelligent systems and networks, such as those used in smart homes, smart cities, and other intelligent scenarios.
The chip model XC6VHX380T-1FFG1155I is a powerful, low-power FPGA that is designed to be upgradeable and is capable of supporting the latest technologies. It is the perfect choice for a wide variety of applications, from high-speed networking to digital signal processing. It can be used in advanced communication systems, such as those used in autonomous vehicles, drones, and other intelligent systems. It is also capable of being used in the era of fully intelligent systems and networks, such as those used in smart homes, smart cities, and other intelligent scenarios. With its wide range of features and ability to be upgraded, the chip model XC6VHX380T-1FFG1155I is an ideal choice for any application that requires the use of cutting-edge technology.
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3,428 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5,366.2637 | $5,366.2637 |
| 10+ | $5,308.5619 | $53,085.6192 |
| 100+ | $5,020.0531 | $502,005.3120 |
| 1000+ | $4,731.5443 | $2,365,772.1600 |
| 10000+ | $4,327.6320 | $4,327,632.0000 |
| The price is for reference only, please refer to the actual quotation! | ||