AMD Xilinx
XC6VHX255T-1FFG1155I
XC6VHX255T-1FFG1155I ECAD Model
XC6VHX255T-1FFG1155I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 440 | |
| Number of Outputs | 440 | |
| Number of Logic Cells | 253440 | |
| Combinatorial Delay of a CLB-Max | 5.08 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1155 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1155 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1155,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, LEAD FREE, FBGA-1155 | |
| Pin Count | 1155 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VHX255T-1FFG1155I Datasheet Download
XC6VHX255T-1FFG1155I Overview
The XC6VHX255T-1FFG1155I chip model is a powerful and versatile model that is suitable for a range of applications, including high-performance digital signal processing, embedded processing, and image processing. This chip model requires the use of the HDL language in order to be used in these applications.
The XC6VHX255T-1FFG1155I chip model offers a number of advantages, including its high performance and low power consumption. The chip model is also highly reliable and is able to operate in a wide range of temperatures. Additionally, the chip model has a wide range of features, including a large memory capacity and support for various communication protocols.
The demand for the XC6VHX255T-1FFG1155I chip model is expected to grow in the future, as more and more applications require the use of this chip model. The chip model is also expected to benefit from the development of new technologies, such as 5G networks and the Internet of Things. This will allow the chip model to be used in more advanced applications and to provide better performance.
The XC6VHX255T-1FFG1155I chip model is a powerful and versatile model that is suitable for a range of applications. With its high performance, low power consumption, and wide range of features, the chip model is expected to remain in high demand in the future. As new technologies are developed, the chip model will become even more useful, allowing it to be used in more advanced applications and to provide better performance.
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2,927 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,773.7287 | $2,773.7287 |
| 10+ | $2,743.9037 | $27,439.0368 |
| 100+ | $2,594.7785 | $259,477.8480 |
| 1000+ | $2,445.6533 | $1,222,826.6400 |
| 10000+ | $2,236.8780 | $2,236,878.0000 |
| The price is for reference only, please refer to the actual quotation! | ||